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CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
Authors:
Marc Jaikissoon,
Çağıl Köroğlu,
Jerry A. Yang,
Kathryn M. Neilson,
Krishna C. Saraswat,
Eric Pop
Abstract:
Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in a CMOS (complementary metal oxide semiconductor) compatible manner would radically improve the industrial viability of 2D transistors. Here, we show silicon nit…
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Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in a CMOS (complementary metal oxide semiconductor) compatible manner would radically improve the industrial viability of 2D transistors. Here, we show silicon nitride cap** layers can impart strain to monolayer MoS2 transistors on conventional silicon substrates, enhancing their electrical performance with a low thermal budget (350 °C), CMOS-compatible approach. Strained back-gated and dual-gated MoS2 transistors demonstrate median increases up to 60% and 45% in on-state current, respectively. The greatest improvements are found when both transistor channels and contacts are reduced to ~200 nm, reaching saturation currents of 488 uA/um, higher than any previous reports at such short contact pitch. Simulations reveal that most benefits arise from tensile strain lowering the contact Schottky barriers, and that further reducing device dimensions (including contacts) will continue to offer increased strain and performance improvements.
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Submitted 29 June, 2024; v1 submitted 15 May, 2024;
originally announced May 2024.
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Imaging the electron charge density in monolayer MoS2 at the Ångstrom scale
Authors:
Joel Martis,
Sandhya Susarla,
Archith Rayabharam,
Cong Su,
Timothy Paule,
Philipp Pelz,
Cassandra Huff,
Xintong Xu,
Hao-Kun Li,
Marc Jaikissoon,
Victoria Chen,
Eric Pop,
Krishna Saraswat,
Alex Zettl,
Narayana R. Aluru,
Ramamoorthy Ramesh,
Peter Ercius,
Arun Majumdar
Abstract:
Four-dimensional scanning transmission electron microscopy (4D-STEM) has recently gained widespread attention for its ability to image atomic electric fields with sub-Ångstrom spatial resolution. These electric field maps represent the integrated effect of the nucleus, core electrons and valence electrons, and separating their contributions is non-trivial. In this paper, we utilized simultaneously…
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Four-dimensional scanning transmission electron microscopy (4D-STEM) has recently gained widespread attention for its ability to image atomic electric fields with sub-Ångstrom spatial resolution. These electric field maps represent the integrated effect of the nucleus, core electrons and valence electrons, and separating their contributions is non-trivial. In this paper, we utilized simultaneously acquired 4D-STEM center of mass (CoM) images and annular dark field (ADF) images to determine the electron charge density in monolayer MoS2. We find that both the core electrons and the valence electrons contribute to the derived electron charge density. However, due to blurring by the probe shape, the valence electron contribution forms a nearly featureless background while most of the spatial modulation comes from the core electrons. Our findings highlight the importance of probe shape in interpreting charge densities derived from 4D STEM.
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Submitted 31 July, 2023; v1 submitted 17 October, 2022;
originally announced October 2022.
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Toward Low-Temperature Solid-Source Synthesis of Monolayer MoS2
Authors:
Alvin Tang,
Aravindh Kumar,
Marc Jaikissoon,
Krishna Saraswat,
H. -S. Philip Wong,
Eric Pop
Abstract:
Two-dimensional (2D) semiconductors have been proposed for heterogeneous integration with existing silicon technology; however, their chemical vapor deposition (CVD) growth temperatures are often too high. Here, we demonstrate direct CVD solid-source precursor synthesis of continuous monolayer (1L) MoS$_2$ films at 560 C in 50 min, within the 450-to-600 C, 2 h thermal budget window required for ba…
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Two-dimensional (2D) semiconductors have been proposed for heterogeneous integration with existing silicon technology; however, their chemical vapor deposition (CVD) growth temperatures are often too high. Here, we demonstrate direct CVD solid-source precursor synthesis of continuous monolayer (1L) MoS$_2$ films at 560 C in 50 min, within the 450-to-600 C, 2 h thermal budget window required for back-end-of-the-line compatibility with modern silicon technology. Transistor measurements reveal on-state current up to ~140 $\mathrm{μA/μm}$ at 1 V drain-to-source voltage for 100 nm channel lengths, the highest reported to date for 1L MoS$_2$ grown below 600 C using solid-source precursors. The effective mobility from transfer length method test structures is $\mathrm{29 \pm 5\ cm^2V^{-1}s^{-1}}$ at $\mathrm{6.1 \times 10^{12}\ cm^{-2}}$ electron density, which is comparable to mobilities reported from films grown at higher temperatures. The results of this work provide a path toward the realization of high-quality, thermal-budget-compatible 2D semiconductors for heterogeneous integration with silicon manufacturing.
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Submitted 4 September, 2021;
originally announced September 2021.
