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Showing 1–3 of 3 results for author: Hong, G H

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  1. Digital Pixel Test Structures implemented in a 65 nm CMOS process

    Authors: Gianluca Aglieri Rinella, Anton Andronic, Matias Antonelli, Mauro Aresti, Roberto Baccomi, Pascal Becht, Stefania Beole, Justus Braach, Matthew Daniel Buckland, Eric Buschmann, Paolo Camerini, Francesca Carnesecchi, Leonardo Cecconi, Edoardo Charbon, Giacomo Contin, Dominik Dannheim, Joao de Melo, Wen**g Deng, Antonello di Mauro, Jan Hasenbichler, Hartmut Hillemanns, Geun Hee Hong, Artem Isakov, Antoine Junique, Alex Kluge , et al. (27 additional authors not shown)

    Abstract: The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the… ▽ More

    Submitted 10 July, 2023; v1 submitted 16 December, 2022; originally announced December 2022.

    Comments: v4: Corrected Table 1. v3: Implemented reviewers' comments. v2: Updated threshold calibration method. Implemented colorblind friendly color palette in all figures. Updated references

  2. arXiv:2105.13000  [pdf, other

    physics.ins-det

    First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors

    Authors: ALICE ITS project, :, G. Aglieri Rinella, M. Agnello, B. Alessandro, F. Agnese, R. S. Akram, J. Alme, E. Anderssen, D. Andreou, F. Antinori, N. Apadula, P. Atkinson, R. Baccomi, A. Badalà, A. Balbino, C. Bartels, R. Barthel, F. Baruffaldi, I. Belikov, S. Beole, P. Becht, A. Bhatti, M. Bhopal, N. Bianchi , et al. (230 additional authors not shown)

    Abstract: A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to ra… ▽ More

    Submitted 17 August, 2021; v1 submitted 27 May, 2021; originally announced May 2021.

  3. arXiv:1804.04357  [pdf

    cond-mat.mtrl-sci

    Photoemission Study of the Electronic Structure of Valence Band Convergent SnSe

    Authors: C. W. Wang, Y. Y. Y. Xia, Z. Tian, J. Jiang, B. H. Li, S. T. Cui, H. F. Yang, A. J. Liang, X. Y. Zhan, G. H. Hong, S. Liu, C. Chen, M. X. Wang, L. X. Yang, Z. Liu, Q. X. Mi, G. Li, J. M. Xue, Z. K. Liu, Y. L. Chen

    Abstract: IV-VI semiconductor SnSe has been known as the material with record high thermoelectric performance.The multiple close-to-degenerate valence bands in the electronic band structure has been one of the key factors contributing to the high power factor and thus figure of merit in the SnSe single crystal. To date, there have been primarily theoretical calculations of this particular electronic band st… ▽ More

    Submitted 12 April, 2018; originally announced April 2018.

    Comments: 14 pages, 5 figures

    Journal ref: Physical Review B 96, 165118 (2017)