E-beam-enhanced solid-state mechanical amorphization of alpha-quartz: Reducing deformation barrier via localized excess electrons as mobile anions
Authors:
Sung-Gyu Kang,
Wonseok Jeong,
Hwangsun Kim,
Jeongin Paeng,
Seungwu Han,
Heung Nam Han,
In-Suk Choi
Abstract:
Under hydrostatic pressure, alpha-quartz undergoes solid-state mechanical amorphization wherein the interpenetration of SiO4 tetrahedra occurs and the material loses crystallinity. This phase transformation requires a high hydrostatic pressure of 14 GPa because the repulsive forces resulting from the ionic nature of the Si-O bonds prevent the severe distortion of the atomic configuration. Herein,…
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Under hydrostatic pressure, alpha-quartz undergoes solid-state mechanical amorphization wherein the interpenetration of SiO4 tetrahedra occurs and the material loses crystallinity. This phase transformation requires a high hydrostatic pressure of 14 GPa because the repulsive forces resulting from the ionic nature of the Si-O bonds prevent the severe distortion of the atomic configuration. Herein, we experimentally and computationally demonstrate that e-beam irradiation changes the nature of the interatomic bonds in alpha-quartz and enhances the solid-state mechanical amorphization at nanoscale. Specifically, during in situ uniaxial compression, a larger permanent deformation occurs in alpha-quartz micropillars compressed during e-beam irradiation than in those without e-beam irradiation. Microstructural analysis reveals that the large permanent deformation under e-beam irradiation originates from the enhanced mechanical amorphization of alpha-quartz and the subsequent viscoplastic deformation of the amorphized region. Further, atomic-scale simulations suggest that the delocalized excess electrons introduced by e-beam irradiation move to highly distorted atomic configurations and alleviate the repulsive force, thus reducing the barrier to the solid-state mechanical amorphization. These findings deepen our understanding of electron-matter interactions and can be extended to new glass forming and processing technologies at nano- and microscale.
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Submitted 26 December, 2022;
originally announced December 2022.
Glass sha** at nanoscale: Mechanical forming of brittle amorphous silica by engineered inelastic interaction of scanning electrons with matter
Authors:
Sung-gyu Kang,
Kyeongjae Jeong,
Woo ** Cho,
Jeongin Paeng,
Jae-Pyeong Ahn,
Steven Boles,
Heung Nam Han,
In-Suk Choi
Abstract:
Amorphous silica deforms viscoplastically at elevated temperatures, as is common for brittle glasses. The key mechanism of viscoplastic deformation involves interatomic bond switching, which is known to be a thermally activated process. In this study, through systematic in-situ compression tests by scanning electron microscopy, the viscoplastic deformation of amorphous silica is observed without t…
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Amorphous silica deforms viscoplastically at elevated temperatures, as is common for brittle glasses. The key mechanism of viscoplastic deformation involves interatomic bond switching, which is known to be a thermally activated process. In this study, through systematic in-situ compression tests by scanning electron microscopy, the viscoplastic deformation of amorphous silica is observed without thermal activation. Furthermore, ductility does not increase monotonically with acceleration voltage and current density of the SEM e-beam but is maximized by a factor of three at a specific acceleration voltage and current density conditions (compared to beam-off conditions). A Monte Carlo simulation of the electron-matter interaction shows that the unique trends of viscoplastic deformation correlate with the interaction volume, i.e., the region within the material where inelastic electron scattering occurs. Changing the size of the migrating atomic clusters can lead to facility in rearrangements of the intramolecular bonds, hence leading to more sustained bond switching. Based on the interaction volume the mechanical sha** of small-scale amorphous silica structures under e-beam irradiation can be modeled with high-precision supporting the idea that this relatively low-voltage e-beam-irradiation induced viscoplastic-deformation technique holds great potential for advancing amorphous silica structure manufacturing and develo** e-beam assisted manufacturing for covalently bonded non-metallic materials.
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Submitted 18 August, 2020;
originally announced August 2020.