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18 GHz Solidly Mounted Resonator in Scandium Aluminum Nitride on SiO2/Ta2O5 Bragg Reflector
Authors:
Omar Barrera,
Nishanth Ravi,
Kapil Saha,
Supratik Dasgupta,
Joshua Campbell,
Jack Kramer,
Eugene Kwon,
Tzu-Hsuan Hsu,
Sinwoo Cho,
Ian Anderson,
Pietro Simeoni,
Jue Hou,
Matteo Rinaldi,
Mark S. Goorsky,
Ruochen Lu
Abstract:
This work reports an acoustic solidly mounted resonator (SMR) at 18.64 GHz, among the highest operating frequencies reported. The device is built in scandium aluminum nitride (ScAlN) on top of silicon dioxide (SiO2) and tantalum pentoxide (Ta2O5) Bragg reflectors on silicon (Si) wafer. The stack is analyzed with X-ray reflectivity (XRR) and high-resolution X-ray diffraction (HRXRD). The resonator…
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This work reports an acoustic solidly mounted resonator (SMR) at 18.64 GHz, among the highest operating frequencies reported. The device is built in scandium aluminum nitride (ScAlN) on top of silicon dioxide (SiO2) and tantalum pentoxide (Ta2O5) Bragg reflectors on silicon (Si) wafer. The stack is analyzed with X-ray reflectivity (XRR) and high-resolution X-ray diffraction (HRXRD). The resonator shows a coupling coefficient (k2) of 2.0%, high series quality factor (Qs) of 156, shunt quality factor (Qp) of 142, and maximum Bode quality factor (Qmax) of 210. The third-order harmonics at 59.64 GHz is also observed with k2 around 0.6% and Q around 40. Upon further development, the reported acoustic resonator platform can enable various front-end signal-processing functions, e.g., filters and oscillators, at future frequency range 3 (FR3) bands.
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Submitted 2 July, 2024;
originally announced July 2024.
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Transferred Thin Film Lithium Niobate as Millimeter Wave Acoustic Filter Platforms
Authors:
Omar Barrera,
Sinwoo Cho,
Kenny Hyunh,
Jack Kramer,
Michael Liao,
Vakhtang Chulukhadze,
Lezli Matto,
Mark S. Goorsky,
Ruochen Lu
Abstract:
This paper reports the first high-performance acoustic filters toward millimeter wave (mmWave) bands using transferred single-crystal thin film lithium niobate (LiNbO3). By transferring LiNbO3 on the top of silicon (Si) and sapphire (Al2O3) substrates with an intermediate amorphous Si (aSi) bonding and sacrificial layer, we demonstrate compact acoustic filters with record-breaking performance beyo…
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This paper reports the first high-performance acoustic filters toward millimeter wave (mmWave) bands using transferred single-crystal thin film lithium niobate (LiNbO3). By transferring LiNbO3 on the top of silicon (Si) and sapphire (Al2O3) substrates with an intermediate amorphous Si (aSi) bonding and sacrificial layer, we demonstrate compact acoustic filters with record-breaking performance beyond 20 GHz. In the LN-aSi-Al2O3 platform, the third-order ladder filter exhibits low insertion loss (IL) of 1.62 dB and 3-dB fractional bandwidth (FBW) of 19.8% at 22.1 GHz, while in the LN-aSi-Si platform, the filter shows low IL of 2.38 dB and FBW of 18.2% at 23.5 GHz. Material analysis validates the great crystalline quality of the stacks. The high-resolution x-ray diffraction (HRXRD) shows full width half maximum (FWHM) of 53 arcsec for Al2O3 and 206 arcsec for Si, both remarkably low compared to piezoelectric thin films of similar thickness. The reported results bring the state-of-the-art (SoA) of compact acoustic filters to much higher frequencies, and highlight transferred LiNbO3 as promising platforms for mmWave filters in future wireless front ends.
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Submitted 21 November, 2023;
originally announced November 2023.
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Thin-Film Lithium Niobate Acoustic Resonator with High Q of 237 and k2 of 5.1% at 50.74 GHz
Authors:
Jack Kramer,
Vakhtang Chulukhadze,
Kenny Huynh,
Omar Barrera,
Michael Liao,
Sinwoo Cho,
Lezli Matto,
Mark S. Goorsky,
Ruochen Lu
Abstract:
This work reports a 50.74 GHz lithium niobate (LiNbO3) acoustic resonator with a high quality factor (Q) of 237 and an electromechanical coupling (k2) of 5.17% resulting in a figure of merit (FoM, Q x k2) of 12.2. The LiNbO3 resonator employs a novel bilayer periodically poled piezoelectric film (P3F) 128 Y-cut LiNbO3 on amorphous silicon (a-Si) on sapphire stack to achieve low losses and high cou…
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This work reports a 50.74 GHz lithium niobate (LiNbO3) acoustic resonator with a high quality factor (Q) of 237 and an electromechanical coupling (k2) of 5.17% resulting in a figure of merit (FoM, Q x k2) of 12.2. The LiNbO3 resonator employs a novel bilayer periodically poled piezoelectric film (P3F) 128 Y-cut LiNbO3 on amorphous silicon (a-Si) on sapphire stack to achieve low losses and high coupling at millimeter wave (mm-wave). The device also shows a Q of 159, k2 of 65.06%, and FoM of 103.4 for the 16.99 GHz tone. This result shows promising prospects of P3F LiNbO3 towards mm-wave front-end filters.
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Submitted 11 July, 2023;
originally announced July 2023.
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Thin-Film Lithium Niobate Acoustic Filter at 23.5 GHz with 2.38 dB IL and 18.2% FBW
Authors:
Omar Barrera,
Sinwoo Cho,
Lezli Matto,
Jack Kramer,
Kenny Huynh,
Vakhtang Chulukhadze,
Yen-Wei Chang,
Mark S. Goorsky,
Ruochen Lu
Abstract:
This work reports an acoustic filter at 23.5 GHz with a low insertion loss (IL) of 2.38 dB and a 3-dB fractional bandwidth (FBW) of 18.2%, significantly surpassing the state-of-the-art. The device leverages electrically coupled acoustic resonators in 100 nm 128° Y-cut lithium niobate (LiNbO3) piezoelectric thin film, operating in the first-order antisymmetric (A1) mode. A new film stack, namely tr…
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This work reports an acoustic filter at 23.5 GHz with a low insertion loss (IL) of 2.38 dB and a 3-dB fractional bandwidth (FBW) of 18.2%, significantly surpassing the state-of-the-art. The device leverages electrically coupled acoustic resonators in 100 nm 128° Y-cut lithium niobate (LiNbO3) piezoelectric thin film, operating in the first-order antisymmetric (A1) mode. A new film stack, namely transferred thin-film LiNbO3 on silicon (Si) substrate with an intermediate amorphous silicon (a-Si) layer, facilitates the record-breaking performance at millimeter-wave (mmWave). The filter features a compact footprint of 0.56 mm2. In this letter, acoustic and EM consideration, along with material characterization with X-ray diffraction and verified with cross-sectional electron microscopy are reported. Upon further development, the reported filter platform can enable various front-end signal-processing functions at mmWave.
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Submitted 10 July, 2023;
originally announced July 2023.
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Defects Evolution and Mg Segregation in Mg-implanted GaN with Ultra-High-Pressure Annealing
Authors:
Y. Wang,
K. Huynh,
M. E. Liao,
J. Tweedie,
P. Reddy,
M. H. Breckenridge,
R. Collazo,
Z. Sitar,
M. Bockowski,
X. Huang,
M. Wojcik,
M. S. Goorsky
Abstract:
Annealing Mg-implanted homoepitaxial GaN at temperatures at or above 1400 °C eliminates the formation of inversion domains and leads to improved dopant activation efficiency. Extended defects in the form of inversion domains contain electrically inactive Mg after post-implantation annealing at temperatures as high as 1300 °C (one GPa N2 overpressure), which results in a low dopant activation effic…
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Annealing Mg-implanted homoepitaxial GaN at temperatures at or above 1400 °C eliminates the formation of inversion domains and leads to improved dopant activation efficiency. Extended defects in the form of inversion domains contain electrically inactive Mg after post-implantation annealing at temperatures as high as 1300 °C (one GPa N2 overpressure), which results in a low dopant activation efficiency. Triple axis X-ray data show that the implant-induced strain is fully relieved after annealing at 1300 °C for 10 min, indicating that the strain-inducing point defects formed during implantation have reconfigured. However, annealing at temperatures of 1400 °C to 1500 °C (also one GPa N2 overpressure) eliminates the presence of the inversion domains. Annealing at these higher temperatures and for a longer time does not have any further impact on the strain state. While residual defects, such as dislocation loops, still exist after annealing at and above 1400 °C, chemical analysis at the dislocation loops shows no sign of Mg segregation. Meanwhile, an overall decreasing trend in the dislocation loop size and density is observed after annealing at higher temperatures and longer times. Earlier work [1] addressing electrical measurements of these types of samples showed that annealing at 1400 °C leads to a dopant activation efficiency that is an order of magnitude higher than that observed at 1300 °C. This work complements the earlier work by identifying the microscopic defects (inversion domains) which incorporate Mg, and points to the benefits, in terms of defect density and p-type dopant activation, of using higher temperatures annealing cycles to activate Mg in GaN.
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Submitted 21 April, 2022;
originally announced April 2022.
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Experimental Observation of Localized Interfacial Phonon Modes
Authors:
Zhe Cheng,
Ruiyang Li,
Xingxu Yan,
Glenn Jernigan,
**g**g Shi,
Michael E. Liao,
Nicholas J. Hines,
Chaitanya A. Gadre,
Juan Carlos Idrobo,
Eungkyu Lee,
Karl D. Hobart,
Mark S. Goorsky,
Xiaoqing Pan,
Tengfei Luo,
Samuel Graham
Abstract:
Interfaces impede heat flow in micro/nanostructured systems. Conventional theories for interfacial thermal transport were derived based on bulk phonon properties of the materials making up the interface without explicitly considering the atomistic interfacial details, which are found critical to correctly describing thermal boundary conductance (TBC). Recent theoretical studies predicted the exist…
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Interfaces impede heat flow in micro/nanostructured systems. Conventional theories for interfacial thermal transport were derived based on bulk phonon properties of the materials making up the interface without explicitly considering the atomistic interfacial details, which are found critical to correctly describing thermal boundary conductance (TBC). Recent theoretical studies predicted the existence of localized phonon modes at the interface which can play an important role in understanding interfacial thermal transport. However, experimental validation is still lacking. Through a combination of Raman spectroscopy and high-energy resolution electron energy-loss spectroscopy (EELS) in a scanning transmission electron microscope, we report the first experimental observation of localized interfacial phonon modes at ~12 THz at a high-quality epitaxial Si-Ge interface. These modes are further confirmed using molecular dynamics simulations with a high-fidelity neural network interatomic potential, which also yield TBC agreeing well with that measured from time-domain thermoreflectance (TDTR) experiments. Simulations find that the interfacial phonon modes have obvious contribution to the total TBC. Our findings may significantly contribute to the understanding of interfacial thermal transport physics and have impact on engineering TBC at interfaces in applications such as electronics thermal management and thermoelectric energy conversion.
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Submitted 29 May, 2021;
originally announced May 2021.
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Approaching the Practical Conductivity Limits of Aerosol Jet Printed Silver
Authors:
Eva S. Rosker,
Michael T. Barako,
Evan Nguyen,
Don DiMarzio,
Kim Kisslinger,
Dah-Weih Duan,
Ra**der Sandhu,
Mark S. Goorsky,
Jesse Tice
Abstract:
Previous efforts to directly write conductive metals have been narrowly focused on nanoparticle ink suspensions that require aggressive sintering (>200 °C) and result in low-density, small-grained agglomerates with electrical conductivities <25% of bulk metal. Here, we demonstrate aerosol jet printing of a reactive ink solution and characterize high-density (93%) printed silver traces having near-…
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Previous efforts to directly write conductive metals have been narrowly focused on nanoparticle ink suspensions that require aggressive sintering (>200 °C) and result in low-density, small-grained agglomerates with electrical conductivities <25% of bulk metal. Here, we demonstrate aerosol jet printing of a reactive ink solution and characterize high-density (93%) printed silver traces having near-bulk conductivity and grain sizes greater than the electron mean free path, while only requiring a low-temperature (80 °C) treatment. We have developed a predictive electronic transport model which correlates the microstructure to the measured conductivity and identifies a strategy to approach the practical conductivity limit for printed metals. Our analysis of how grain boundaries and tortuosity contribute to electrical resistivity provides insight into the basic materials science that governs how an ink formulator or process developer might approach improving the conductivity. Transmission line measurements validate that electrical properties are preserved up to 20 GHz, which demonstrates the utility of this technique for printed RF components. This work reveals a new method of producing robust printed electronics that retain the advantages of rapid prototy** and three-dimensional fabrication while achieving the performance necessary for success within the aerospace and communications industries.
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Submitted 13 July, 2020;
originally announced July 2020.
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A Refined Model for Epitaxial Tilt of Epilayers Grown on Miscut Substrates
Authors:
Michael E. Liao,
Mark S. Goorsky
Abstract:
A refined model of the origin of epitaxial tilt on miscut (or vicinal) substrates is explained by employing crystal modeling and reciprocal space analysis. The Nagai tilt model (H. Nagai, J. Appl. Phys., 45, 3789 (1974)) is often cited to explain the tilt of lattice planes in a pseudomorphic layer deposited on a miscut substrate that is observed in high resolution x-ray diffraction measurements. H…
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A refined model of the origin of epitaxial tilt on miscut (or vicinal) substrates is explained by employing crystal modeling and reciprocal space analysis. The Nagai tilt model (H. Nagai, J. Appl. Phys., 45, 3789 (1974)) is often cited to explain the tilt of lattice planes in a pseudomorphic layer deposited on a miscut substrate that is observed in high resolution x-ray diffraction measurements. Here, however, we demonstrate how that model incorrectly describes how the substrate applies biaxial stress onto the epitaxial layer. Most importantly, the stress applied to an epitaxial layer on a miscut substrate is not along a low index plane. For example, the surface plane of a nominally (001) cubic substrate with a miscut of 10° towards the [110] is the (118) plane and the stress applied is parallel along the (118) plane and not (001). Furthermore, under the framework of reciprocal space, the {00l} reflections would be symmetric reflections for on-axis substrates but asymmetric reflections for miscut substrates. The tilt that is experimentally observed between the low index substrate planes and the epitaxial layer planes ((001) for example with a miscut substrate) matches that which is predicted by treating the low index reflections as asymmetric reflections. An epitaxial tilt equation is provided which describes the tilt between epitaxial and substrate layers based on the lattice parameter mismatch as well as the Poisson ratio of the layer that is applicable to any crystal system.
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Submitted 9 June, 2020;
originally announced June 2020.
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Wafer-scale Heterogeneous Integration of Monocrystalline \b{eta}-Ga2O3 Thin Films on SiC for Thermal Management by Ion-Cutting Technique
Authors:
Zhe Cheng,
Fengwen Mu,
Tiangui You,
Wenhui Xu,
**g**g Shi,
Michael E. Liao,
Yekan Wang,
Kenny Huynh,
Tadatomo Suga,
Mark S. Goorsky,
Xin Ou,
Samuel Graham
Abstract:
The ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates make \b{eta}-Ga2O3 promising for applications of next-generation power electronics while its thermal conductivity is at least one order of magnitude lower than other wide/ultrawide bandgap semiconductors. To avoid the degradation of device performance and reliability induced by the localized Joule-heating,…
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The ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates make \b{eta}-Ga2O3 promising for applications of next-generation power electronics while its thermal conductivity is at least one order of magnitude lower than other wide/ultrawide bandgap semiconductors. To avoid the degradation of device performance and reliability induced by the localized Joule-heating, aggressive thermal management strategies are essential, especially for high-power high-frequency applications. This work reports a scalable thermal management strategy to heterogeneously integrate wafer-scale monocrystalline \b{eta}-Ga2O3 thin films on high thermal conductivity SiC substrates by ion-cutting technique. The thermal boundary conductance (TBC) of the \b{eta}-Ga2O3-SiC interfaces and thermal conductivity of the \b{eta}-Ga2O3 thin films were measured by Time-domain Thermoreflectance (TDTR) to evaluate the effects of interlayer thickness and thermal annealing. Materials characterizations were performed to understand the mechanisms of thermal transport in these structures. The results show that the \b{eta}-Ga2O3-SiC TBC values increase with decreasing interlayer thickness and the \b{eta}-Ga2O3 thermal conductivity increases more than twice after annealing at 800 oC due to the removal of implantation-induced strain in the films. A Callaway model is built to understand the measured thermal conductivity. Small spot-to-spot variations of both TBC and Ga2O3 thermal conductivity confirm the uniformity and high-quality of the bonding and exfoliation. Our work paves the way for thermal management of power electronics and \b{eta}-Ga2O3 related semiconductor devices.
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Submitted 26 May, 2020;
originally announced May 2020.
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Experimental Observation of High Intrinsic Thermal Conductivity of AlN
Authors:
Zhe Cheng,
Yee Rui Koh,
Abdullah Mamun,
**g**g Shi,
Tingyu Bai,
Kenny Huynh,
Luke Yates,
Zeyu Liu,
Ruiyang Li,
Eungkyu Lee,
Michael Liao,
Yekan Wang,
Hsuan Ming Yu,
Maki Kushimoto,
Tengfei Luo,
Mark S. Goorsky,
Patrick E. Hopkins,
Hiroshi Amano,
Asif Khan,
Samuel Graham
Abstract:
AlN is an ultra-wide bandgap semiconductor which has been developed for applications including power electronics and optoelectronics. Thermal management of these applications is the key for stable device performance and allowing for long lifetimes. AlN, with its potentially high thermal conductivity, can play an important role serving as a dielectric layer, growth substrate, and heat spreader to i…
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AlN is an ultra-wide bandgap semiconductor which has been developed for applications including power electronics and optoelectronics. Thermal management of these applications is the key for stable device performance and allowing for long lifetimes. AlN, with its potentially high thermal conductivity, can play an important role serving as a dielectric layer, growth substrate, and heat spreader to improve device performance. However, the intrinsic high thermal conductivity of bulk AlN predicted by theoretical calculations has not been experimentally observed because of the difficulty in producing materials with low vacancy and impurity levels, and other associated defect complexes in AlN which can decrease the thermal conductivity. This work reports the growth of thick AlN layers by MOCVD with an air-pocketed AlN layer and the first experimental observation of intrinsic thermal conductivity from 130 K to 480 K that matches density-function-theory calculations for single crystal AlN, producing some of the highest values ever measured. Detailed material characterizations confirm the high quality of these AlN samples with one or two orders of magnitude lower impurity concentrations than seen in commercially available bulk AlN. Measurements of these commercially available bulk AlN substrates from 80 K to 480 K demonstrated a lower thermal conductivity, as expected. A theoretical thermal model is built to interpret the measured temperature dependent thermal conductivity. Our work demonstrates that it is possible to obtain theoretically high values of thermal conductivity in AlN and such films may impact the thermal management and reliability of future electronic and optoelectronics devices.
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Submitted 4 November, 2019;
originally announced November 2019.
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Molecular Beam Epitaxy Growth of High Crystalline Quality LiNbO$_{3}$
Authors:
M. Brooks Tellekamp,
Joshua C. Shank,
Mark S. Goorsky,
W. Alan Doolittle
Abstract:
Lithium niobate is a multi-functional material with wide reaching applications in acoustics, optics, and electronics. Commercial applications for lithium niobate require high crystalline quality currently limited to bulk and ion sliced material. Thin film lithium niobate is an attractive option for a variety of integrated devices, but the research effort has been stagnant due to poor material qual…
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Lithium niobate is a multi-functional material with wide reaching applications in acoustics, optics, and electronics. Commercial applications for lithium niobate require high crystalline quality currently limited to bulk and ion sliced material. Thin film lithium niobate is an attractive option for a variety of integrated devices, but the research effort has been stagnant due to poor material quality. Both lattice matched and mismatched lithium niobate are grown by molecular beam epitaxy (MBE) and studied to understand the role of substrate and temperature on nucleation conditions and material quality. Growth on sapphire produces partially coalesced columnar grains with atomically flat plateaus and no twin planes. A symmetric rocking curve shows a narrow linewidth with a full width at half-maximum (FWHM) of 8.6 arcsec (0.0024°) which is comparable to the 5.8 arcsec rocking curve FWHM of the substrate, while the film asymmetric rocking curve is 510 arcsec FWHM. These values indicate that the individual grains are relatively free of long-range disorder detectable by x-ray diffraction (XRD) with minimal measurable tilt and twist and represents the highest structural quality epitaxial material grown on lattice mismatched sapphire without twin planes. Lithium niobate is also grown on lithium tantalate producing high quality coalesced material without twin planes and with a symmetric rocking curve of 193 arcsec, which is nearly equal to the substrate rocking curve of 194 arcsec. The surface morphology of lithium niobate on lithium tantalate is shown to be atomically flat by atomic force microscopy (AFM).
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Submitted 8 October, 2019;
originally announced October 2019.
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Integration of Atomic Layer Epitaxy Crystalline Ga2O3 on Diamond for Thermal Management
Authors:
Zhe Cheng,
Virginia D. Wheeler,
Tingyu Bai,
**g**g Shi,
Marko J. Tadjer,
Tatyana Feygelson,
Karl D. Hobart,
Mark S. Goorsky,
Samuel Graham
Abstract:
Ga2O3 has attracted great attention for electronic device applications due to its ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates grown from the melt. However, its thermal conductivity is significantly lower than that of other wide bandgap semiconductors, which will impact its ability to be used in high power density applications. Thermal management in Ga2O3…
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Ga2O3 has attracted great attention for electronic device applications due to its ultra-wide bandgap, high breakdown electric field, and large-area affordable substrates grown from the melt. However, its thermal conductivity is significantly lower than that of other wide bandgap semiconductors, which will impact its ability to be used in high power density applications. Thermal management in Ga2O3 electronics will be the key for device reliability, especially for high power and high frequency devices. Similar to the method of cooling GaN-based high electron mobility transistors by integrating it with high thermal conductivity diamond substrates, this work studies the possibility of heterogeneous integration of Ga2O3 with diamond for thermal management of Ga2O3 devices. In this work, Ga2O3 was deposited onto single crystal diamond substrates by ALD and the thermal properties of ALD-Ga2O3 thin films and Ga2O3-diamond interfaces with different interface pretreatments were measured by TDTR. We observed very low thermal conductivity of these Ga2O3 thin films due to the extensive phonon grain boundary scattering resulting from the nanocrystalline nature of the Ga2O3 film. However, the measured thermal boundary conductance (TBC) of the Ga2O3-diamond interfaces are about 10 times larger than that of the Van der Waals bonded Ga2O3 diamond interfaces, which indicates the significant impact of interface bonding on TBC. Furthermore, the TBC of the Ga-rich and O-rich Ga2O3-diamond interfaces are about 20% smaller than that of the clean interface, indicating interface chemistry affects interfacial thermal transport. Overall, this study shows that a high TBC can be obtained from strong interfacial bonds across Ga2O3-diamond interfaces, providing a promising route to improving the heat dissipation from Ga2O3 devices.
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Submitted 23 August, 2019;
originally announced August 2019.
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Thermal Conductance Across Harmonic-matched Epitaxial Al-sapphire Heterointerfaces
Authors:
Zhe Cheng,
Yee Rui Koh,
Habib Ahmad,
Renjiu Hu,
**g**g Shi,
Michael E. Liao,
Yekan Wang,
Tingyu Bai,
Ruiyang Li,
Eungkyu Lee,
Evan A. Clinton,
Christopher M. Matthews,
Zachary Engel,
Yates,
Tengfei Luo,
Mark S. Goorsky,
William Doolittle,
Zhiting Tian,
Patrick E. Hopkins,
Samuel Graham
Abstract:
A unified understanding of interfacial thermal transport is missing due to the complicated nature of interfaces which involves complex factors such as interfacial bonding, interfacial mixing, surface chemistry, crystal orientation, roughness, contamination, and interfacial disorder. This is especially true for metal nonmetal interfaces which incorporate multiple fundamental heat transport mechanis…
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A unified understanding of interfacial thermal transport is missing due to the complicated nature of interfaces which involves complex factors such as interfacial bonding, interfacial mixing, surface chemistry, crystal orientation, roughness, contamination, and interfacial disorder. This is especially true for metal nonmetal interfaces which incorporate multiple fundamental heat transport mechanisms such as elastic and inelastic phonon scattering as well as electron phonon coupling in the metal and across the interface. All these factors jointly affect thermal boundary conductance (TBC). As a result, the experimentally measured interfaces may not be the same as the ideally modelled interfaces, thus obfuscating any conclusions drawn from experimental and modeling comparisons. This work provides a systematic study of interfacial thermal conductance across well controlled and ultraclean epitaxial (111) Al parallel (0001) sapphire interfaces, known as harmonic matched interface. A comparison with thermal models such as atomistic Green s function (AGF) and a nonequilibrium Landauer approach shows that elastic phonon scattering dominates the interfacial thermal transport of Al sapphire interface. By scaling the TBC with the Al heat capacity, a nearly constant transmission coefficient is observed, indicating that the phonons on the Al side limits the Al sapphire TBC. This nearly constant transmission coefficient validates the assumptions in AGF and nonequilibrium Landauer calculations. Our work not only provides a benchmark for interfacial thermal conductance across metal nonmetal interfaces and enables a quantitative study of TBC to validate theoretical thermal carrier transport mechanisms, but also acts as a reference when studying how other factors impact TBC.
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Submitted 23 September, 2019; v1 submitted 13 June, 2019;
originally announced June 2019.
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Thermal boundary conductance across epitaxial ZnO/GaN interfaces: Assessment of phonon gas models and atomistic Green's function approaches for predicting interfacial phonon transport
Authors:
John T. Gaskins,
George Kotsonis,
Ashutosh Giri,
Christopher T. Shelton,
Edward Sachet,
Zhe Cheng,
Brian M. Foley,
Zeyu Liu,
Shenghong Ju,
Junichiro,
Mark S. Goorsky,
Samuel Graham,
Tengfei Luo,
Asegun Henry,
Jon-Paul Maria,
Patrick E. Hopkins
Abstract:
We present experimental measurements of the thermal boundary conductance (TBC) from $77 - 500$ K across isolated heteroepitaxially grown ZnO films on GaN substrates. These data provide an assessment of the assumptions that drive the phonon gas model-based diffuse mismatch models (DMM) and atomistic Green's function (AGF) formalisms for predicting TBC. Our measurements, when compared to previous ex…
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We present experimental measurements of the thermal boundary conductance (TBC) from $77 - 500$ K across isolated heteroepitaxially grown ZnO films on GaN substrates. These data provide an assessment of the assumptions that drive the phonon gas model-based diffuse mismatch models (DMM) and atomistic Green's function (AGF) formalisms for predicting TBC. Our measurements, when compared to previous experimental data, suggest that the TBC can be influenced by long wavelength, zone center modes in a material on one side of the interface as opposed to the "vibrational mismatch" concept assumed in the DMM; this disagreement is pronounced at high temperatures. At room temperature, we measure the ZnO/GaN TBC as $490\lbrack +150, -110\rbrack$ MW m$^{-2}$ K$^{-1}$. The disagreement among the DMM and AGF and the experimental data these elevated temperatures suggests a non-negligible contribution from additional modes contributing to TBC that not accounted for in the fundamental assumptions of these harmonic formalisms, such as inelastic scattering. Given the high quality of these ZnO/GaN interface, these results provide an invaluable critical and quantitive assessment of the accuracy of assumptions in the current state of the art of computational approaches for predicting the phonon TBC across interfaces.
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Submitted 25 October, 2017;
originally announced October 2017.
