Showing 1–16 of 16 results for author: Gonella, L

Characterisation of analogue Monolithic Active Pixel Sensor test structures implemented in a 65 nm CMOS imaging process

Authors: Gianluca Aglieri Rinella, Giacomo Alocco, Matias Antonelli, Roberto Baccomi, Stefania Maria Beole, Mihail Bogdan Blidaru, Bent Benedikt Buttwill, Eric Buschmann, Paolo Camerini, Francesca Carnesecchi, Marielle Chartier, Yongjun Choi, Manuel Colocci, Giacomo Contin, Dominik Dannheim, Daniele De Gruttola, Manuel Del Rio Viera, Andrea Dubla, Antonello di Mauro, Maurice Calvin Donner, Gregor Hieronymus Eberwein, Jan Egger, Laura Fabbietti, Finn Feindt, Kunal Gautam , et al. (69 additional authors not shown)

Abstract: Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: do** levels, pixel geometries and pixel pitches (10-25… ▽ More Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: do** levels, pixel geometries and pixel pitches (10-25 $μ$m). These variants have been tested following exposure to varying levels of irradiation up to 3 MGy and $10^{16}$ 1 MeV n$_\text{eq}$ cm$^{-2}$. Here the results from prototypes that feature direct analogue output of a 4$\times$4 pixel matrix are reported, allowing the systematic and detailed study of charge collection properties. Measurements were taken both using $^{55}$Fe X-ray sources and in beam tests using minimum ionizing particles. The results not only demonstrate the feasibility of using this technology for particle detection but also serve as a reference for future applications and optimisations. △ Less

Submitted 13 March, 2024; originally announced March 2024.

Performance of the MALTA Telescope

Authors: Milou van Rijnbach, Giuliano Gustavino, Phil Allport, Igancio Asensi, Dumitru Vlad Berlea, Daniela Bortoletto, Craig Buttar, Edoardo Charbon, Florian Dachs, Valerio Dao, Dominik Dobrijevic, Leyre Flores Sanz de Acedo, Andrea Gabrielli, Martin Gazi, Laura Gonella, Vicente Gonzalez, Stefan Guindon, Matt LeBlanc, Heinz Pernegger, Francesco Piro, Petra Riedler, Heidi Sandaker, Abhishek Sharma, Carlos Solans Sanchez, Walter Snoeys , et al. (5 additional authors not shown)

Abstract: MALTA is part of the Depleted Monolithic Active Pixel sensors designed in Tower 180nm CMOS imaging technology. A custom telescope with six MALTA planes has been developed for test beam campaigns at SPS, CERN, with the ability to host several devices under test. The telescope system has a dedicated custom readout, online monitoring integrated into DAQ with realtime hit map, time distribution and ev… ▽ More MALTA is part of the Depleted Monolithic Active Pixel sensors designed in Tower 180nm CMOS imaging technology. A custom telescope with six MALTA planes has been developed for test beam campaigns at SPS, CERN, with the ability to host several devices under test. The telescope system has a dedicated custom readout, online monitoring integrated into DAQ with realtime hit map, time distribution and event hit multiplicity. It hosts a dedicated fully configurable trigger system enabling to trigger on coincidence between telescope planes and timing reference from a scintillator. The excellent time resolution performance allows for fast track reconstruction, due to the possibility to retain a low hit multiplicity per event which reduces the combinatorics. This paper reviews the architecture of the system and its performance during the 2021 and 2022 test beam campaign at the SPS North Area. △ Less

Submitted 21 April, 2023; v1 submitted 3 April, 2023; originally announced April 2023.

MALTA-Cz: A radiation hard full-size monolithic CMOS sensor with small electrodes on high-resistivity Czochralski substrate

Authors: H. Pernegger, P. Allport, D. V. Berlea, A. Birman, D. Bortoletto, C. Buttar, E. Charbon, F. Dachs, V. Dao, H. Denizli, D. Dobrijevic, M. Dyndal, A. Fenigstein, L. Flores Sanz de Acedo, P. Freeman, A. Gabrielli, M. Gazi, L. Gonella, V. Gonzalez, G. Gustavino, A. Haim, T. Kugathasan, M. LeBlanc, M. Munker, K. Y. Oyulmaz , et al. (14 additional authors not shown)

Abstract: Depleted Monolithic Active Pixel Sensor (DMAPS) sensors developed in the Tower Semiconductor 180 nm CMOS imaging process have been designed in the context of the ATLAS ITk upgrade Phase-II at the HL-LHC and for future collider experiments. The "MALTA-Czochralski (MALTA-Cz)" full size DMAPS sensor has been developed with the goal to demonstrate a radiation hard, thin CMOS sensor with high granulari… ▽ More Depleted Monolithic Active Pixel Sensor (DMAPS) sensors developed in the Tower Semiconductor 180 nm CMOS imaging process have been designed in the context of the ATLAS ITk upgrade Phase-II at the HL-LHC and for future collider experiments. The "MALTA-Czochralski (MALTA-Cz)" full size DMAPS sensor has been developed with the goal to demonstrate a radiation hard, thin CMOS sensor with high granularity, high hit-rate capability, fast response time and superior radiation tolerance. The small pixel size ($36.4\times 36.4$~$μ$m$^2$) provides high spatial resolution. Its asynchronous readout architecture is designed for high hit-rates and fast time response in triggered and trigger-less detector applications. The readout architecture is designed to stream all hit data to the multi-channel output which allows an off-sensor trigger formation and the use of hit-time information for event tagging. The sensor manufacturing has been optimised through process adaptation and special implant designs to allow the manufacturing of small electrode DMAPS on thick high-resistivity p-type Czochralski substrate. The special processing ensures excellent charge collection and charge particle detection efficiency even after a high level of radiation. Furthermore the special implant design and use of a Czochralski substrate improves the sensor's time resolution. This paper presents a summary of sensor design optimisation through process and implant choices and TCAD simulation to model the signal response. Beam and laboratory test results on unirradiated and irradiated sensors have shown excellent detection efficiency after a dose of $2\times10^{15}$ 1 MeV n$_{eq}$/cm$^{2}$. The time resolution of the sensor is measured to be $σ=2$~ns. △ Less

Submitted 13 September, 2023; v1 submitted 10 January, 2023; originally announced January 2023.

Journal ref: JINST 18 P09018 (2023)

ATHENA Detector Proposal -- A Totally Hermetic Electron Nucleus Apparatus proposed for IP6 at the Electron-Ion Collider

Authors: ATHENA Collaboration, J. Adam, L. Adamczyk, N. Agrawal, C. Aidala, W. Akers, M. Alekseev, M. M. Allen, F. Ameli, A. Angerami, P. Antonioli, N. J. Apadula, A. Aprahamian, W. Armstrong, M. Arratia, J. R. Arrington, A. Asaturyan, E. C. Aschenauer, K. Augsten, S. Aune, K. Bailey, C. Baldanza, M. Bansal, F. Barbosa, L. Barion , et al. (415 additional authors not shown)

Abstract: ATHENA has been designed as a general purpose detector capable of delivering the full scientific scope of the Electron-Ion Collider. Careful technology choices provide fine tracking and momentum resolution, high performance electromagnetic and hadronic calorimetry, hadron identification over a wide kinematic range, and near-complete hermeticity. This article describes the detector design and its e… ▽ More ATHENA has been designed as a general purpose detector capable of delivering the full scientific scope of the Electron-Ion Collider. Careful technology choices provide fine tracking and momentum resolution, high performance electromagnetic and hadronic calorimetry, hadron identification over a wide kinematic range, and near-complete hermeticity. This article describes the detector design and its expected performance in the most relevant physics channels. It includes an evaluation of detector technology choices, the technical challenges to realizing the detector and the R&D required to meet those challenges. △ Less

Submitted 13 October, 2022; originally announced October 2022.

Journal ref: JINST 17 (2022) 10, P10019

Timing performance of radiation hard MALTA monolithic Pixel sensors

Authors: G. Gustavino, P. Allport, I. Asensi, D. V. Berlea, D. Bortoletto, C. Buttar, F. Dachs, V. Dao, H. Denizli, D. Dobrijevic, L. Flores, A. Gabrielli, L. Gonella, V. González, M. LeBlanc, K. Oyulmaz, H. Pernegger, F. Piro, P. Riedler, H. Sandaker, C. Solans, W. Snoeys, T. Suligoj, M. van Rijnbach, A. Sharma , et al. (4 additional authors not shown)

Abstract: The MALTA family of Depleted Monolithic Active Pixel Sensor (DMAPS) produced in Tower 180 nm CMOS technology targets radiation hard applications for the HL-LHC and beyond. Several process modifications and front-end improvements have resulted in radiation hardness up to $2 \times 10^{15}~1~\text{MeV}~\text{n}_{eq}/\text{cm}^2$ and time resolution below 2 ns, with uniform charge collection efficien… ▽ More The MALTA family of Depleted Monolithic Active Pixel Sensor (DMAPS) produced in Tower 180 nm CMOS technology targets radiation hard applications for the HL-LHC and beyond. Several process modifications and front-end improvements have resulted in radiation hardness up to $2 \times 10^{15}~1~\text{MeV}~\text{n}_{eq}/\text{cm}^2$ and time resolution below 2 ns, with uniform charge collection efficiency across the Pixel of size $36.4 \times 36.4~μ\text{m}^2$ with a $3~μ\text{m}^2$ electrode size. The MALTA2 demonstrator produced in 2021 on high-resistivity epitaxial silicon and on Czochralski substrates implements a new cascoded front-end that reduces the RTS noise and has a higher gain. This contribution shows results from MALTA2 on timing resolution at the nanosecond level from the CERN SPS test-beam campaign of 2021. △ Less

Submitted 31 January, 2023; v1 submitted 29 September, 2022; originally announced September 2022.

Comments: 8 pages, 8 figures. Submitted to Journal of Instrumentation (JINST). Proceedings of the 23rd International Workshop on Radiation Imaging Detectors IWORID 2022

Recent results with radiation-tolerant TowerJazz 180 nm MALTA Sensors

Authors: Matt LeBlanc, Phil Allport, Igancio Asensi, Dumitru-Vlad Berlea, Daniela Bortoletto, Craig Buttar, Florian Dachs, Valerio Dao, Haluk Denizli, Dominik Dobrijevic, Leyre Flores, Andrea Gabrielli, Laura Gonella, Vicente González, Giuliano Gustavino, Kaan Oyulmaz, Heinz Pernegger, Francesco Piro, Petra Riedler, Heidi Sandaker, Carlos Solans, Walter Snoeys, Tomislav Suligoj, Milou van Rijnbach, Abhishek Sharma , et al. (4 additional authors not shown)

Abstract: To achieve the physics goals of future colliders, it is necessary to develop novel, radiation-hard silicon sensors for their tracking detectors. We target the replacement of hybrid pixel detectors with Depleted Monolithic Active Pixel Sensors (DMAPS) that are radiation-hard, monolithic CMOS sensors. We have designed, manufactured and tested the MALTA series of sensors, which are DMAPS in the 180 n… ▽ More To achieve the physics goals of future colliders, it is necessary to develop novel, radiation-hard silicon sensors for their tracking detectors. We target the replacement of hybrid pixel detectors with Depleted Monolithic Active Pixel Sensors (DMAPS) that are radiation-hard, monolithic CMOS sensors. We have designed, manufactured and tested the MALTA series of sensors, which are DMAPS in the 180 nm TowerJazz CMOS imaging technology. MALTA have a pixel pitch well below current hybrid pixel detectors, high time resolution (< 2 ns) and excellent charge collection efficiency across pixel geometries. These sensors have a total silicon thickness of between 50-300 $μ$m, implying reduced material budgets and multiple scattering rates for future detectors which utilize such technology. Furthermore, their monolithic design bypasses the costly stage of bump-bonding in hybrid sensors and can substantially reduce detector costs. This contribution presents the latest results from characterization studies of the MALTA2 sensors, including results demonstrating the radiation tolerance of these sensors. △ Less

Submitted 9 September, 2022; originally announced September 2022.

Comments: 4 pages, 4 figures. Accepted by Nuclear Inst. and Methods in Physics Research, A (Proceedings of VCI 2022)

Science Requirements and Detector Concepts for the Electron-Ion Collider: EIC Yellow Report

Authors: R. Abdul Khalek, A. Accardi, J. Adam, D. Adamiak, W. Akers, M. Albaladejo, A. Al-bataineh, M. G. Alexeev, F. Ameli, P. Antonioli, N. Armesto, W. R. Armstrong, M. Arratia, J. Arrington, A. Asaturyan, M. Asai, E. C. Aschenauer, S. Aune, H. Avagyan, C. Ayerbe Gayoso, B. Azmoun, A. Bacchetta, M. D. Baker, F. Barbosa, L. Barion , et al. (390 additional authors not shown)

Abstract: This report describes the physics case, the resulting detector requirements, and the evolving detector concepts for the experimental program at the Electron-Ion Collider (EIC). The EIC will be a powerful new high-luminosity facility in the United States with the capability to collide high-energy electron beams with high-energy proton and ion beams, providing access to those regions in the nucleon… ▽ More This report describes the physics case, the resulting detector requirements, and the evolving detector concepts for the experimental program at the Electron-Ion Collider (EIC). The EIC will be a powerful new high-luminosity facility in the United States with the capability to collide high-energy electron beams with high-energy proton and ion beams, providing access to those regions in the nucleon and nuclei where their structure is dominated by gluons. Moreover, polarized beams in the EIC will give unprecedented access to the spatial and spin structure of the proton, neutron, and light ions. The studies leading to this document were commissioned and organized by the EIC User Group with the objective of advancing the state and detail of the physics program and develo** detector concepts that meet the emerging requirements in preparation for the realization of the EIC. The effort aims to provide the basis for further development of concepts for experimental equipment best suited for the science needs, including the importance of two complementary detectors and interaction regions. This report consists of three volumes. Volume I is an executive summary of our findings and developed concepts. In Volume II we describe studies of a wide range of physics measurements and the emerging requirements on detector acceptance and performance. Volume III discusses general-purpose detector concepts and the underlying technologies to meet the physics requirements. These considerations will form the basis for a world-class experimental program that aims to increase our understanding of the fundamental structure of all visible matter △ Less

Submitted 26 October, 2021; v1 submitted 8 March, 2021; originally announced March 2021.

Comments: 902 pages, 415 authors, 151 institutions

Report number: BNL-220990-2021-FORE, JLAB-PHY-21-3198, LA-UR-21-20953

Journal ref: Nucl. Phys. A 1026 (2022) 122447

The ABC130 barrel module prototy** programme for the ATLAS strip tracker

Authors: Luise Poley, Craig Sawyer, Sagar Addepalli, Anthony Affolder, Bruno Allongue, Phil Allport, Eric Anderssen, Francis Anghinolfi, Jean-François Arguin, Jan-Hendrik Arling, Olivier Arnaez, Nedaa Alexandra Asbah, Joe Ashby, Eleni Myrto Asimakopoulou, Naim Bora Atlay, Ludwig Bartsch, Matthew J. Basso, James Beacham, Scott L. Beaupré, Graham Beck, Carl Beichert, Laura Bergsten, Jose Bernabeu, Prajita Bhattarai, Ingo Bloch , et al. (224 additional authors not shown)

Abstract: For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000… ▽ More For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototy** programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototy** program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests. △ Less

Submitted 7 September, 2020; originally announced September 2020.

Comments: 82 pages, 66 figures

Journal ref: published 3 September 2020, Journal of Instrumentation, Volume 15, September 2020

Mini-MALTA: Radiation hard pixel designs for small-electrode monolithic CMOS sensors for the High Luminosity LHC

Authors: M. Dyndal, V. Dao, P. Allport, I. Asensi Tortajada, M. Barbero, S. Bhat, D. Bortoletto, I. Berdalovic, C. Bespin, C. Buttar, I. Caicedo, R. Cardella, F. Dachs, Y. Degerli, H. Denizli, L. Flores Sanz de Acedo, P. Freeman, L. Gonella, A. Habib, T. Hemperek, T. Hirono, B. Hiti, T. Kugathasan, I. Mandić, D. Maneuski , et al. (19 additional authors not shown)

Abstract: Depleted Monolithic Active Pixel Sensor (DMAPS) prototypes developed in the TowerJazz 180 nm CMOS imaging process have been designed in the context of the ATLAS upgrade Phase-II at the HL-LHC. The pixel sensors are characterized by a small collection electrode (3 $μ$m) to minimize capacitance, a small pixel size ($36.4\times 36.4$ $μ$m), and are produced on high resistivity epitaxial p-type silico… ▽ More Depleted Monolithic Active Pixel Sensor (DMAPS) prototypes developed in the TowerJazz 180 nm CMOS imaging process have been designed in the context of the ATLAS upgrade Phase-II at the HL-LHC. The pixel sensors are characterized by a small collection electrode (3 $μ$m) to minimize capacitance, a small pixel size ($36.4\times 36.4$ $μ$m), and are produced on high resistivity epitaxial p-type silicon. The design targets a radiation hardness of $1\times10^{15}$ 1 MeV n$_{eq}$/cm$^{2}$, compatible with the outermost layer of the ATLAS ITK Pixel detector. This paper presents the results from characterization in particle beam tests of the Mini-MALTA prototype that implements a mask change or an additional implant to address the inefficiencies on the pixel edges. Results show full efficiency after a dose of $1\times10^{15}$ 1 MeV n$_{eq}$/cm$^{2}$. △ Less

Submitted 14 December, 2019; v1 submitted 26 September, 2019; originally announced September 2019.

Measurement of the relative response of TowerJazz Mini-MALTA CMOS prototypes at Diamond Light Source

Authors: Maria Mironova, Kaloyan Metodiev, Phil Allport, Ivan Berdalovic, Daniela Bortoletto, Craig Buttar, Roberto Cardella, Valerio Dao, Mateusz Dyndal, Patrick Freeman, Leyre Flores Sanz de Acedo, Laura Gonella, Thanushan Kugathasan, Heinz Pernegger, Francesco Piro, Richard Plackett, Petra Riedler, Abhishek Sharma, Enrico Junior Schioppa, Ian Shipsey, Carlos Solans Sanchez, Walter Snoeys, Hakan Wennloef, Daniel Weatherill, Daniel Wood , et al. (1 additional authors not shown)

Abstract: This paper outlines the results of investigations into the effects of radiation damage in the mini-MALTA prototype. Measurements were carried out at Diamond Light Source using a micro-focus X-ray beam, which scanned across the surface of the device in 2 $\mathrm{μm}$ steps. This allowed the in-pixel photon response to be measured directly with high statistics. Three pixel design variations were co… ▽ More This paper outlines the results of investigations into the effects of radiation damage in the mini-MALTA prototype. Measurements were carried out at Diamond Light Source using a micro-focus X-ray beam, which scanned across the surface of the device in 2 $\mathrm{μm}$ steps. This allowed the in-pixel photon response to be measured directly with high statistics. Three pixel design variations were considered: one with the standard continuous $\mathrm{n^-}$ layer layout and front-end, and extra deep p-well and $\mathrm{n^-}$ gap designs with a modified front-end. Five chips were measured: one unirradiated, one neutron irradiated, and three proton irradiated. △ Less

Submitted 2 October, 2019; v1 submitted 18 September, 2019; originally announced September 2019.

Experimental Determination of Proton Hardness Factors at Several Irradiation Facilities

Authors: P. Allport, F. Bogelspacher, K. Bruce, R. Canavan, A. Dierlamm, L. Gonella, P. Knights, I. Mateu, M. Moll, K. Nikolopoulos, B. Phoenix, T. Price, L. Ram, F. Ravotti, C. Simpson-Allsop, C. Wood

Abstract: The scheduled High Luminosity upgrade of the CERN Large Hadron Collider presents new challenges in terms of radiation hardness. As a consequence, campaigns to qualify the radiation hardness of detector sensors and components are undertaken worldwide. The effects of irradiation with beams of different particle species and energy, aiming to assess displacement damage in semiconductor devices, are co… ▽ More The scheduled High Luminosity upgrade of the CERN Large Hadron Collider presents new challenges in terms of radiation hardness. As a consequence, campaigns to qualify the radiation hardness of detector sensors and components are undertaken worldwide. The effects of irradiation with beams of different particle species and energy, aiming to assess displacement damage in semiconductor devices, are communicated in terms of the equivalent 1 MeV neutron fluence, using the hardness factor for the conversion. In this work, the hardness factors for protons at three different kinetic energies have been measured by analysing the I-V and C-V characteristics of reverse biased diodes, pre- and post-irradiation. The sensors were irradiated at the MC40 Cyclotron of the University of Birmingham, the cyclotron at the Karlsruhe Institute of Technology, and the IRRAD proton facility at CERN, with the respective measured proton hardness factors being: 2.1 +/- 0.5 for 24 MeV, 2.2 +/- 0.4 for 23 MeV, and 0.62 +/- 0.04 for 23 GeV. The hardness factors currently used in these three facilities are in agreement with the presented measurements. △ Less

Submitted 12 November, 2019; v1 submitted 8 August, 2019; originally announced August 2019.

Comments: 13 pages, 12 figures

Journal ref: JINST 14 (2019) P12004

Production and Integration of the ATLAS Insertable B-Layer

Authors: B. Abbott, J. Albert, F. Alberti, M. Alex, G. Alimonti, S. Alkire, P. Allport, S. Altenheiner, L. Ancu, E. Anderssen, A. Andreani, A. Andreazza, B. Axen, J. Arguin, M. Backhaus, G. Balbi, J. Ballansat, M. Barbero, G. Barbier, A. Bassalat, R. Bates, P. Baudin, M. Battaglia, T. Beau, R. Beccherle , et al. (352 additional authors not shown)

Abstract: During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and i… ▽ More During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, smaller radius beam pipe. The motivation for this new pixel layer, the Insertable B-Layer (IBL), was to maintain or improve the robustness and performance of the ATLAS tracking system, given the higher instantaneous and integrated luminosities realised following the shutdown. Because of the extreme radiation and collision rate environment, several new radiation-tolerant sensor and electronic technologies were utilised for this layer. This paper reports on the IBL construction and integration prior to its operation in the ATLAS detector. △ Less

Submitted 6 June, 2018; v1 submitted 2 March, 2018; originally announced March 2018.

Comments: 90 pages in total. Author list: ATLAS IBL Collaboration, starting page 2. 69 figures, 20 tables. Published in Journal of Instrumentation. All figures available at: https://atlas.web.cern.ch/Atlas/GROUPS/PHYSICS/PLOTS/PIX-2018-001

Journal ref: Journal of Instrumentation JINST 13 T05008 (2018)

Radiation hard pixel sensors using high-resistive wafers in a 150 nm CMOS processing line

Authors: D. -L. Pohl, T. Hemperek, I. Caicedo, L. Gonella, F. Hügging, J. Janssen, H. Krüger, A. Macchiolo, N. Owtscharenko, L. Vigani, N. Wermes

Abstract: Pixel sensors using 8" CMOS processing technology have been designed and characterized offering the benefits of industrial sensor fabrication, including large wafers, high throughput and yield, as well as low cost. The pixel sensors are produced using a 150 nm CMOS technology offered by LFoundry in Avezzano. The technology provides multiple metal and polysilicon layers, as well as metal-insulator-… ▽ More Pixel sensors using 8" CMOS processing technology have been designed and characterized offering the benefits of industrial sensor fabrication, including large wafers, high throughput and yield, as well as low cost. The pixel sensors are produced using a 150 nm CMOS technology offered by LFoundry in Avezzano. The technology provides multiple metal and polysilicon layers, as well as metal-insulator-metal capacitors that can be employed for AC-coupling and redistribution layers. Several prototypes were fabricated and are characterized with minimum ionizing particles before and after irradiation to fluences up to 1.1 $\times$ 10$^{15}$ n$_{\rm eq}$ cm$^{-2}$. The CMOS-fabricated sensors perform equally well as standard pixel sensors in terms of noise and hit detection efficiency. AC-coupled sensors even reach 100% hit efficiency in a 3.2 GeV electron beam before irradiation. △ Less

Submitted 2 March, 2017; v1 submitted 16 February, 2017; originally announced February 2017.

Comments: 10 pages, 6 figures

Neutron irradiation test of depleted CMOS pixel detector prototypes

Authors: Igor Mandić, Vladimir Cindro, Andrej Gorišek, Bojan Hiti, Gregor Kramberger, Marko Mikuž, Marko Zavrtanik, Tomasz Hemperek, Michael Daas, Fabian Hügging, Hans Krügerc, David-Leon Pohl, Norbert Wermes, Laura Gonella

Abstract: Charge collection properties of depleted CMOS pixel detector prototypes produced on p-type substrate of 2 k$Ω$cm initial resistivity (by LFoundry 150 nm process) were studied using Edge-TCT method before and after neutron irradiation. The test structures were produced for investigation of CMOS technology in tracking detectors for experiments at HL-LHC upgrade. Measurements were made with passive d… ▽ More Charge collection properties of depleted CMOS pixel detector prototypes produced on p-type substrate of 2 k$Ω$cm initial resistivity (by LFoundry 150 nm process) were studied using Edge-TCT method before and after neutron irradiation. The test structures were produced for investigation of CMOS technology in tracking detectors for experiments at HL-LHC upgrade. Measurements were made with passive detector structures in which current pulses induced on charge collecting electrodes could be directly observed. Thickness of depleted layer was estimated and studied as function of neutron irradiation fluence. An increase of depletion thickness was observed after first two irradiation steps to 1$\cdot$10$^{13}$ n/cm$^{2}$ and 5$\cdot$10$^{13}$ n/cm$^{2}$ and attributed to initial acceptor removal. At higher fluences the depletion thickness at given voltage decreases with increasing fluence because of radiation induced defects contributing to the effective space charge concentration. The behaviour is consistent with that of high resistivity silicon used for standard particle detectors. The measured thickness of the depleted layer after irradiation with 1$\cdot$10$^{15}$ n/cm$^{2}$ is more than 50 $μ$m at 100 V bias. This is sufficient to guarantee satisfactory signal/noise performance on outer layers of pixel trackers in HL-LHC experiments. △ Less

Submitted 18 January, 2017; originally announced January 2017.

Prototype Active Silicon Sensor in 150 nm HR-CMOS Technology for ATLAS Inner Detector Upgrade

Authors: Piotr Rymaszewski, Marlon Barbero, Patrick Breugnon, Stépahnie Godiot, Laura Gonella, Tomasz Hemperek, Toko Hirono, Fabian Hügging, Hans Krüger, Jian Liu, Patrick Pangaud, Ivan Peric, Alexandre Rozanov, Anqing Wang, Norbert Wermes

Abstract: The LHC Phase-II upgrade will lead to a significant increase in luminosity, which in turn will bring new challenges for the operation of inner tracking detectors. A possible solution is to use active silicon sensors, taking advantage of commercial CMOS technologies. Currently ATLAS R&D programme is qualifying a few commercial technologies in terms of suitability for this task. In this paper a prot… ▽ More The LHC Phase-II upgrade will lead to a significant increase in luminosity, which in turn will bring new challenges for the operation of inner tracking detectors. A possible solution is to use active silicon sensors, taking advantage of commercial CMOS technologies. Currently ATLAS R&D programme is qualifying a few commercial technologies in terms of suitability for this task. In this paper a prototype designed in one of them (LFoundry 150 nm process) will be discussed. The chip architecture will be described, including different pixel types incorporated into the design, followed by simulation and measurement results. △ Less

Submitted 4 January, 2016; originally announced January 2016.

Comments: 9 pages, 9 figures, TWEPP 2015 Conference, submitted to JINST

Existence of Periodic Solutions for some Singular Elliptic Equations with Strong Resonant Data

Authors: Laura Gonella

Abstract: We prove the existence of at least one T-periodic solution (T > 0) for differential equations of the form (u'(t)/sqrt{1-u'^2(t)})'=f(u(t))+h(t), in (0,T), where f is a continuous function defined on R that satisfies a strong resonance condition, h is continuous and with zero mean value. Our method uses variational techniques for nonsmooth functionals. We prove the existence of at least one T-periodic solution (T > 0) for differential equations of the form (u'(t)/sqrt{1-u'^2(t)})'=f(u(t))+h(t), in (0,T), where f is a continuous function defined on R that satisfies a strong resonance condition, h is continuous and with zero mean value. Our method uses variational techniques for nonsmooth functionals. △ Less

Submitted 14 December, 2011; originally announced December 2011.