Showing 1–12 of 12 results for author: Gluschke, J G

The effect of direct electron beam patterning on the water uptake and ionic conductivity of Nafion thin films

Authors: Ky V. Nguyen, Jan G. Gluschke, A. Bernardus Mostert, Andrew Nelson, Gregory Burwell, Roman W. Lyttleton, Hamish Cavaye, Rebecca J. L. Welbourn, Jakob Seidl, Maxime Lagier, Marta Sanchez Miranda, James D. McGettrick, Trystan Watson, Paul Meredith, Adam P. Micolich

Abstract: We report the effect of electron-beam patterning on the water uptake and ionic conductivity of Nafion films using a combination of x-ray photoelectron spectroscopy, quartz crystal microbalance studies, neutron reflectometry, and AC impedance spectroscopy. The aim was to more fully characterize the nature of the nanoscale patterned Nafion structures recently used as a key element in novel ion-to-el… ▽ More We report the effect of electron-beam patterning on the water uptake and ionic conductivity of Nafion films using a combination of x-ray photoelectron spectroscopy, quartz crystal microbalance studies, neutron reflectometry, and AC impedance spectroscopy. The aim was to more fully characterize the nature of the nanoscale patterned Nafion structures recently used as a key element in novel ion-to-electron transducers by Gluschke et al. To enable these studies, we develop the electron beam patterning process for large areas, achieving patterning speeds approaching 1 cm$^{2}$/hr, and patterned areas as large as 7 cm$^{2}$ for the neutron reflectometry studies. We ultimately show that electron-beam patterning affects both the water uptake and the ionic conductivity, depending on film thickness. We see Type-II adsorption isotherm behaviour for all films. For thick films (~230 nm), we see a strong reduction in water uptake with electron-beam patterning. In contrast, for thin films (~30 nm), electron-beam patterning enhances water uptake. Notably, we find that for either thickness the reduction in ionic conductivity arising from electron-beam patterning is kept to less than an order of magnitude. We propose mechanisms for the observed behaviour based on the known complex morphology of Nafion films to motivate future studies of electron-beam processed Nafion. △ Less

Submitted 21 June, 2023; originally announced June 2023.

Journal ref: Advanced Electronic Materials 2300199 (2023)

Integrated bioelectronic proton-gated logic elements utilizing nanoscale patterned Nafion

Authors: J. G. Gluschke, J. Seidl, R. W. Lyttleton, K. Nguyen, M. Lagier, F. Meyer, P. Krogstrup, J. Nygard, S. Lehmann, A. B. Mostert, P. Meredith, A. P. Micolich

Abstract: A central endeavour in bioelectronics is the development of logic elements to transduce and process ionic to electronic signals. Motivated by this challenge, we report fully monolithic, nanoscale logic elements featuring n- and p-type nanowires as electronic channels that are proton-gated by electron-beam patterned Nafion. We demonstrate inverter circuits with state-of-the-art ion-to-electron tran… ▽ More A central endeavour in bioelectronics is the development of logic elements to transduce and process ionic to electronic signals. Motivated by this challenge, we report fully monolithic, nanoscale logic elements featuring n- and p-type nanowires as electronic channels that are proton-gated by electron-beam patterned Nafion. We demonstrate inverter circuits with state-of-the-art ion-to-electron transduction performance giving DC gain exceeding 5 and frequency response up to 2 kHz. A key innovation facilitating the logic integration is a new electron-beam process for patterning Nafion with linewidths down to 125 nm. This process delivers feature sizes compatible with low voltage, fast switching elements. This expands the scope for Nafion as a versatile patternable high-proton-conductivity element for bioelectronics and other applications requiring nanoengineered protonic membranes and electrodes. △ Less

Submitted 14 May, 2023; originally announced May 2023.

Journal ref: Mater. Horiz. 8, 224 (2021)

Post-growth sha** and transport anisotropy in 2D InAs nanofins

Authors: J. Seidl, J. G. Gluschke, X. Yuan, H. H. Tan, C. Jagadish, P. Caroff, A. P. Micolich

Abstract: We report on the post-growth sha** of free-standing 2D InAs nanofins that are grown by selective-area epitaxy and mechanically transferred to a separate substrate for device fabrication. We use a citric acid based wet etch that enables complex shapes, e.g., van der Pauw cloverleaf structures, with patterning resolution down to 150 nm as well as partial thinning of the nanofin to improve the gate… ▽ More We report on the post-growth sha** of free-standing 2D InAs nanofins that are grown by selective-area epitaxy and mechanically transferred to a separate substrate for device fabrication. We use a citric acid based wet etch that enables complex shapes, e.g., van der Pauw cloverleaf structures, with patterning resolution down to 150 nm as well as partial thinning of the nanofin to improve the gate response. We exploit the high sensitivity of the cloverleaf structures to transport anisotropy to address the fundamental question of whether there is a measurable transport anisotropy arising from wurtzite/zincblende polytypism in 2D InAs nanostructures. We demonstrate a mobility anisotropy of order 2-4 at room temperature arising from polytypic stacking faults in our nanofins. Our work highlights a key materials consideration for devices featuring self-assembled 2D III-V nanostructures using advanced epitaxy methods. △ Less

Submitted 14 May, 2023; originally announced May 2023.

Journal ref: ACS Nano 15, 7226 (2021)

Impact of invasive metal probes on Hall measurements in semiconductor nanostructures

Authors: J. G. Gluschke, J. Seidl, H. H. Tan, C. Jagadish, P. Caroff, A. P. Micolich

Abstract: Recent advances in bottom-up growth are giving rise to a range of new two-dimensional nanostructures. Hall effect measurements play an important role in their electrical characterization. However, size constraints can lead to device geometries that deviate significantly from the ideal of elongated Hall bars with currentless contacts. Many devices using these new materials have a low aspect ratio a… ▽ More Recent advances in bottom-up growth are giving rise to a range of new two-dimensional nanostructures. Hall effect measurements play an important role in their electrical characterization. However, size constraints can lead to device geometries that deviate significantly from the ideal of elongated Hall bars with currentless contacts. Many devices using these new materials have a low aspect ratio and feature metal Hall probes that overlap with the semiconductor channel. This can lead to a significant distortion of the current flow. We present experimental data from InAs 2D nanofin devices with different Hall probe geometries to study the influence of Hall probe length and width. We use finite-element simulations to further understand the implications of these aspects and expand the scope to contact resistance and sample aspect ratios. Our key finding is that invasive probes lead to a significant underestimation in the measured Hall voltage, typically of the order of 40-80%. This in turn leads to a subsequent proportional overestimation of carrier concentration and an underestimation of mobility △ Less

Submitted 19 October, 2020; originally announced October 2020.

Comments: 8 pages, 7 figures

Journal ref: Nanoscale 12, 20317-20325 (2020)

A parylene coating system specifically designed for producing ultra-thin films for nanoscale device applications

Authors: J. G. Gluschke, F. Richter, A. P. Micolich

Abstract: We report on a parylene chemical vapor deposition system custom designed for producing ultra-thin parylene films (5-100 nm thickness) for use as an electrical insulator in nanoscale electronic devices, including as the gate insulator in transistors. The system features a small deposition chamber that can be isolated and purged for process termination, a quartz crystal microbalance for monitoring d… ▽ More We report on a parylene chemical vapor deposition system custom designed for producing ultra-thin parylene films (5-100 nm thickness) for use as an electrical insulator in nanoscale electronic devices, including as the gate insulator in transistors. The system features a small deposition chamber that can be isolated and purged for process termination, a quartz crystal microbalance for monitoring deposition, and a rotating angled stage to increase coating conformity. The system was mostly built from off-the-shelf vacuum fittings allowing for easy modification and reduced cost compared to commercial parylene coating systems. The production of ultra-thin parylene films for device applications is a niche not well catered to by commercial coating systems, which are typically designed to give thicker coatings (microns) with high uniformity over much larger areas. An added advantage of our design for nanoscale device applications is that the small deposition chamber is readily removable for transfer to a glovebox to enable parylene deposition onto pristine surfaces prepared in oxygen/water-free environments with minimal contamination. △ Less

Submitted 12 September, 2019; originally announced September 2019.

Journal ref: Rev. Sci. Instrum. 90, 083901 (2019)

Regaining a spatial dimension: Mechanically transferrable two-dimensional InAs nanofins grown by selective area epitaxy

Authors: J. Seidl, J. G. Gluschke, X. Yuan, S. Naureen, N. Shahid, H. H. Tan, C. Jagadish, A. P. Micolich, P. Caroff

Abstract: We report a method for growing rectangular InAs nanofins with deterministic length, width and height by dielectric-templated selective-area epitaxy. These freestanding nanofins can be transferred to lay flat on a separate substrate for device fabrication. A key goal was to regain a spatial dimension for device design compared to nanowires, whilst retaining the benefits of bottom-up epitaxial growt… ▽ More We report a method for growing rectangular InAs nanofins with deterministic length, width and height by dielectric-templated selective-area epitaxy. These freestanding nanofins can be transferred to lay flat on a separate substrate for device fabrication. A key goal was to regain a spatial dimension for device design compared to nanowires, whilst retaining the benefits of bottom-up epitaxial growth. The transferred nanofins were made into devices featuring multiple contacts for Hall effect and four-terminal resistance studies, as well as a global back-gate and nanoscale local top-gates for density control. Hall studies give a 3D electron density $2.5~-~5 \times 10^{17}$ cm$^{-3}$, corresponding to an approximate surface accumulation layer density $3~-~6 \times 10^{12}$ cm$^{-2}$ that agrees well with previous studies of InAs nanowires. We obtain Hall mobilities as high as $1200$ cm$^{2}$/Vs, field-effect mobilities as high as $4400$ cm$^{2}$/Vs and clear quantum interference structure at temperatures as high as $20$ K. Our devices show excellent prospects for fabrication into more complicated devices featuring multiple ohmic contacts, local gates and possibly other functional elements, e.g., patterned superconductor contacts, that may make them attractive options for future quantum information applications. △ Less

Submitted 28 June, 2019; originally announced July 2019.

Comments: 36 pages, 5 figures, in press for Nano Letters

Achieving short high-quality gate-all-around structures for horizontal nanowire field-effect transistors

Authors: J. G. Gluschke, J. Seidl, A. M. Burke, R. W. Lyttleton, D. J. Carrad, A. R. Ullah, S. Fahlvik Svensson, S. Lehmann, H. Linke, A. P. Micolich

Abstract: We introduce a fabrication method for gate-all-around nanowire field-effect transistors. Single nanowires were aligned perpendicular to underlying bottom gates using a resist-trench alignment technique. Top gates were then defined aligned to the bottom gates to form gate-all-around structures. This approach overcomes significant limitations in minimal obtainable gate length and gate-length control… ▽ More We introduce a fabrication method for gate-all-around nanowire field-effect transistors. Single nanowires were aligned perpendicular to underlying bottom gates using a resist-trench alignment technique. Top gates were then defined aligned to the bottom gates to form gate-all-around structures. This approach overcomes significant limitations in minimal obtainable gate length and gate-length control in previous horizontal wrap-gated nanowire transistors that arise because the gate is defined by wet etching. In the method presented here gate-length control is limited by the resolution of the electron-beam-lithography process. We demonstrate the versatility of our approach by fabricating a device with an independent bottom gate, top gate, and gate-all-around structure as well as a device with three independent gate-all-around structures with 300 nm, 200 nm, and 150 nm gate length. Our method enables us to achieve sub-threshold swings as low as 38 mV/dec at 77 K for a 150 nm gate length. △ Less

Submitted 8 October, 2018; originally announced October 2018.

Comments: Submitted to Nanotechnology

p-GaAs nanowire MESFETs with near-thermal limit gating

Authors: A. R. Ullah, F. Meyer, J. G. Gluschke, S. Naureen, P. Caroff, P. Krogstrup, J. Nygard, A. P. Micolich

Abstract: Difficulties in obtaining high-performance p-type transistors and gate insulator charge-trap** effects present two major challenges for III-V complementary metal-oxide semiconductor (CMOS) electronics. We report a p-GaAs nanowire metal-semiconductor field-effect transistor (MESFET) that eliminates the need for a gate insulator by exploiting the Schottky barrier at the metal-GaAs interface. Our d… ▽ More Difficulties in obtaining high-performance p-type transistors and gate insulator charge-trap** effects present two major challenges for III-V complementary metal-oxide semiconductor (CMOS) electronics. We report a p-GaAs nanowire metal-semiconductor field-effect transistor (MESFET) that eliminates the need for a gate insulator by exploiting the Schottky barrier at the metal-GaAs interface. Our device beats the best-performing p-GaSb nanowire metal-oxide-semiconductor field effect transistor (MOSFET), giving a typical sub-threshold swing of 62 mV/dec, within 4% of the thermal limit, on-off ratio $\sim 10^{5}$, on-resistance ~700 k$Ω$, contact resistance ~30 k$Ω$, peak transconductance 1.2 $μ$S/$μ$m and high-fidelity ac operation at frequencies up to 10 kHz. The device consists of a GaAs nanowire with an undoped core and heavily Be-doped shell. We carefully etch back the nanowire at the gate locations to obtain Schottky-barrier insulated gates whilst leaving the doped shell intact at the contacts to obtain low contact resistance. Our device opens a path to all-GaAs nanowire MESFET complementary circuits with simplified fabrication and improved performance. △ Less

Submitted 27 September, 2018; originally announced September 2018.

Journal ref: Nano Letters 18, 5673-5680 (2018)

Using ultra-thin parylene films as an organic gate insulator in nanowire field-effect transistors

Authors: J. G. Gluschke, J. Seidl, R. W. Lyttleton, D. J. Carrad, J. W. Cochrane, S. Lehmann, L. Samuelson, A. P. Micolich

Abstract: We report the development of nanowire field-effect transistors featuring an ultra-thin parylene film as a polymer gate insulator. The room temperature, gas-phase deposition of parylene is an attractive alternative to oxide insulators prepared at high temperatures using atomic layer deposition. We discuss our custom-built parylene deposition system, which is designed for reliable and controlled dep… ▽ More We report the development of nanowire field-effect transistors featuring an ultra-thin parylene film as a polymer gate insulator. The room temperature, gas-phase deposition of parylene is an attractive alternative to oxide insulators prepared at high temperatures using atomic layer deposition. We discuss our custom-built parylene deposition system, which is designed for reliable and controlled deposition of <100 nm thick parylene films on III-V nanowires standing vertically on a growth substrate or horizontally on a device substrate. The former case gives conformally-coated nanowires, which we used to produce functional $Ω$-gate and gate-all-around structures. These give sub-threshold swings as low as 140 mV/dec and on/off ratios exceeding $10^3$ at room temperature. For the gate-all-around structure, we developed a novel fabrication strategy that overcomes some of the limitations with previous lateral wrap-gate nanowire transistors. Finally, we show that parylene can be deposited over chemically-treated nanowire surfaces; a feature generally not possible with oxides produced by atomic layer deposition due to the surface `self-cleaning' effect. Our results highlight the potential for parylene as an alternative ultra-thin insulator in nanoscale electronic devices more broadly, with potential applications extending into nanobioelectronics due to parylene's well-established biocompatible properties. △ Less

Submitted 27 September, 2018; originally announced September 2018.

Journal ref: Nano Letters 18, 4431-4439 (2018)

Towards low-dimensional hole systems in Be-doped GaAs nanowires

Authors: A. R. Ullah, J. G. Gluschke, P. Krogstrup, C. B. Sørensen, J. Nygård, A. P. Micolich

Abstract: GaAs was central to the development of quantum devices but is rarely used for nanowire-based quantum devices with InAs, InSb and SiGe instead taking the leading role. p-type GaAs nanowires offer a path to studying strongly-confined 0D and 1D hole systems with strong spin-orbit effects, motivating our development of nanowire transistors featuring Be-doped p-type GaAs nanowires, AuBe alloy contacts… ▽ More GaAs was central to the development of quantum devices but is rarely used for nanowire-based quantum devices with InAs, InSb and SiGe instead taking the leading role. p-type GaAs nanowires offer a path to studying strongly-confined 0D and 1D hole systems with strong spin-orbit effects, motivating our development of nanowire transistors featuring Be-doped p-type GaAs nanowires, AuBe alloy contacts and patterned local gate electrodes towards making nanowire-based quantum hole devices. We report on nanowire transistors with traditional substrate back-gates and EBL-defined metal/oxide top-gates produced using GaAs nanowires with three different Be-do** densities and various AuBe contact processing recipes. We show that contact annealing only brings small improvements for the moderately-doped devices under conditions of lower anneal temperature and short anneal time. We only obtain good transistor performance for moderate do**, with conduction freezing out at low temperature for lowly-doped nanowires and inability to reach a clear off-state under gating for the highly-doped nanowires. Our best devices give on-state conductivity 95 nS, off-state conductivity 2 pS, on-off ratio ~$10^{4}$, and sub-threshold slope 50 mV/dec at T = 4 K. Lastly, we made a device featuring a moderately-doped nanowire with annealed contacts and multiple top-gates. Top-gate sweeps show a plateau in the sub-threshold region that is reproducible in separate cool-downs and indicative of possible conductance quantization highlighting the potential for future quantum device studies in this material system. △ Less

Submitted 12 April, 2017; originally announced April 2017.

Journal ref: Nanotechnology 28, 134005 (2017)

InAs nanowire transistors with multiple, independent wrap-gate segments

Authors: A. M. Burke, D. J. Carrad, J. G. Gluschke, K. Storm, S. Fahlvik Svensson, H. Linke, L. Samuelson, A. P. Micolich

Abstract: We report a method for making horizontal wrap-gate nanowire transistors with up to four independently controllable wrap-gated segments. While the step up to two independent wrap-gates requires a major change in fabrication methodology, a key advantage to this new approach, and the horizontal orientation more generally, is that achieving more than two wrap-gate segments then requires no extra fabri… ▽ More We report a method for making horizontal wrap-gate nanowire transistors with up to four independently controllable wrap-gated segments. While the step up to two independent wrap-gates requires a major change in fabrication methodology, a key advantage to this new approach, and the horizontal orientation more generally, is that achieving more than two wrap-gate segments then requires no extra fabrication steps. This is in contrast to the vertical orientation, where a significant subset of the fabrication steps needs to be repeated for each additional gate. We show that cross-talk between adjacent wrap-gate segments is negligible despite separations less than 200 nm. We also demonstrate the ability to make multiple wrap-gate transistors on a single nanowire using the exact same process. The excellent scalability potential of horizontal wrap-gate nanowire transistors makes them highly favourable for the development of advanced nanowire devices and possible integration with vertical wrap-gate nanowire transistors in 3D nanowire network architectures. △ Less

Submitted 7 May, 2015; originally announced May 2015.

Comments: 18 pages, 5 figures, In press for Nano Letters (DOI below)

Thermoelectric performance of classical topological insulator nanowires

Authors: Johannes Gooth, Jan Goeran Gluschke, Robert Zierold, Martin Leijnse, Heiner Linke, Kornelius Nielsch

Abstract: There is currently substantial effort being invested into creating efficient thermoelectric nanowires based on topological insulator chalcogenide-type materials. A key premise of these efforts is the assumption that the generally good thermoelectric properties that these materials exhibit in bulk form will translate into similarly good or even better thermoelectric performance of the same material… ▽ More There is currently substantial effort being invested into creating efficient thermoelectric nanowires based on topological insulator chalcogenide-type materials. A key premise of these efforts is the assumption that the generally good thermoelectric properties that these materials exhibit in bulk form will translate into similarly good or even better thermoelectric performance of the same materials in nanowire form. Here, we calculate thermoelectric performance of topological insulator nanowires based on Bi2Te3, Sb2Te3 and Bi2Se3 as a function of diameter and Fermi level. We show that the thermoelectric performance of topological insulator nanowires does not derive from the properties of the bulk material in a straightforward way. For all investigated systems the competition between surface states and bulk channel causes a significant modification of the thermoelectric transport coefficients if the diameter is reduced into the sub-10 um range. Key aspects are that the surface and bulk states are optimized at different Fermi levels or have different polarity as well as the high surface to volume ratio of the nanowires. This limits the maximum thermoelectric performance of topological insulator nanowires and thus their application in efficient thermoelectric devices. △ Less

Submitted 20 April, 2015; v1 submitted 7 May, 2014; originally announced May 2014.