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Materials for High Temperature Digital Electronics
Authors:
Dhiren K. Pradhan,
David C. Moore,
A. Matt Francis,
Jacob Kupernik,
W. Joshua Kennedy,
Nicholas R. Glavin,
Roy H. Olsson III,
Deep Jariwala
Abstract:
Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportation, entertainment, and healthcare. Despite the widespread and mainstream use, current silicon-based devices suffer significant reliability issues at temperatures exceeding 125 °C. The emergent technological frontiers of s…
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Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportation, entertainment, and healthcare. Despite the widespread and mainstream use, current silicon-based devices suffer significant reliability issues at temperatures exceeding 125 °C. The emergent technological frontiers of space exploration, geothermal energy harvesting, nuclear energy, unmanned avionic systems, and autonomous driving will rely on control systems, sensors, and communication devices which operate at temperatures as high as 500 °C and beyond. At these extreme temperatures, active (heat exchanger, phase change cooling) or passive (fins and thermal interface materials) cooling strategies add significant mass and complication which is often infeasible. Thus, new material solutions beyond conventional silicon CMOS devices are necessary for high temperature, resilient electronic systems. Accomplishing this will require a united effort to explore development, integration, and ultimately manufacturing of non-silicon-based logic and memory technologies, non-traditional metals for interconnects, and ceramic packaging technology.
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Submitted 4 April, 2024;
originally announced April 2024.
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Two-step conversion of metal and metal oxide precursor films to 2D transition metal dichalcogenides and heterostructures
Authors:
Michael Altvater,
Christopher Muratore,
Michael Snure,
Nicholas Glavin
Abstract:
From the laboratory to real-world applications, synthesis of two dimensional (2D) materials requires modular techniques to control morphology, structure, chemistry, and the plethora of exciting properties arising from these nanoscale materials. In this review, we explore one of the many available synthesis techniques; the extremely versatile two-step conversion (2SC) method. The 2SC technique reli…
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From the laboratory to real-world applications, synthesis of two dimensional (2D) materials requires modular techniques to control morphology, structure, chemistry, and the plethora of exciting properties arising from these nanoscale materials. In this review, we explore one of the many available synthesis techniques; the extremely versatile two-step conversion (2SC) method. The 2SC technique relies on deposition of a metal or metal oxide film, followed by reaction with a chalcogen vapor at an elevated temperature, converting the precursor film to a crystalline transition metal dichalcogenide (TMD). Herein, we consider the variables at each step of the 2SC process including the impact of the precursor film material and deposition technique, the influence of gas composition and temperature during conversion, as well as other factors controlling high quality 2D TMD synthesis. We feature the specific advantages to the 2SC approach including deposition on diverse substrates, low temperature processing, orientation control, and heterostructure synthesis, among others. Finally, emergent opportunities that take advantage of the 2SC approach are discussed to include next generation electronics, sensing, and optoelectronic devices as well as catalysis for energy-related applications; spotlighting the great potential of the 2SC technique.
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Submitted 29 January, 2024;
originally announced January 2024.
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Probing interlayer interactions and commensurate-incommensurate transition in twisted bilayer graphene through Raman spectroscopy
Authors:
Vineet Pandey,
Subhendu Mishra,
Nikhilesh Maity,
Sourav Paul,
Abhijith M B,
Ajit Roy,
Nicholas R Glavin,
Kenji Watanabe,
Takashi Taniguchi,
Abhishek Kumar Singh,
Vidya Kochat
Abstract:
Twisted 2D layered materials have garnered a lot of attention recently as a class of 2D materials whose interlayer interactions and electronic properties are dictated by the relative rotation / twist angle between the adjacent layers. In this work, we explore a prototype of such a twisted 2D system, artificially stacked twisted bilayer graphene (TBLG), where we probe the changes in the interlayer…
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Twisted 2D layered materials have garnered a lot of attention recently as a class of 2D materials whose interlayer interactions and electronic properties are dictated by the relative rotation / twist angle between the adjacent layers. In this work, we explore a prototype of such a twisted 2D system, artificially stacked twisted bilayer graphene (TBLG), where we probe the changes in the interlayer interactions and electron-phonon scattering pathways as the twist angle is varied from 0° to 30°, using Raman spectroscopy. The long range Moiré potential of the superlattice gives rise to additional intravalley and intervalley scattering of the electrons in TBLG which have been investigated through their Raman signatures. The density functional theory (DFT) calculations of the electronic band structure of the TBLG superlattices was found to be in agreement with the resonant Raman excitations across the van Hove singularities in the valence and conduction bands predicted for TBLG due to hybridization of bands from the two layers. We also observe that the relative rotation between the graphene layers has a marked influence on the second order overtone and combination Raman modes signalling a commensurate-incommensurate transition in TBLG as the twist angle increases. This serves as a convenient and rapid characterization tool to determine the degree of commensurability in TBLG systems.
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Submitted 2 November, 2023;
originally announced November 2023.
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Scalable and Stable Ferroelectric Non-Volatile Memory at > 500 $^\circ$C
Authors:
Dhiren K. Pradhan,
David C. Moore,
Gwangwoo Kim,
Yunfei He,
Pariasadat Musavigharavi,
Kwan-Ho Kim,
Nishant Sharma,
Zirun Han,
Xingyu Du,
Venkata S. Puli,
Eric A. Stach,
W. Joshua Kennedy,
Nicholas R. Glavin,
Roy H. Olsson III,
Deep Jariwala
Abstract:
Non-volatile memory (NVM) devices that reliably operate at temperatures above 300 $^\circ$C are currently non-existent and remains a critically unmet challenge in the development of high-temperature (T) resilient electronics, necessary for many emerging, complex computing and sensing in harsh environments. Ferroelectric Al$_x$Sc$_{1-x}$N exhibits strong potential for utilization in NVM devices ope…
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Non-volatile memory (NVM) devices that reliably operate at temperatures above 300 $^\circ$C are currently non-existent and remains a critically unmet challenge in the development of high-temperature (T) resilient electronics, necessary for many emerging, complex computing and sensing in harsh environments. Ferroelectric Al$_x$Sc$_{1-x}$N exhibits strong potential for utilization in NVM devices operating at very high temperatures (> 500 $^\circ$C) given its stable and high remnant polarization (PR) above 100 $μ$C/cm$^2$ with demonstrated ferroelectric transition temperature (TC) > 1000 $^\circ$C. Here, we demonstrate an Al$_{0.68}$Sc$_{0.32}$N ferroelectric diode based NVM device that can reliably operate with clear ferroelectric switching up to 600 $^\circ$C with distinguishable On and Off states. The coercive field (EC) from the Pulsed I-V measurements is found to be -5.84 (EC-) and +5.98 (EC+) (+/- 0.1) MV/cm at room temperature (RT) and found to decrease with increasing temperature up to 600 $^\circ$C. The devices exhibit high remnant polarizations (> 100 $μ$C/cm$^2$) which are stable at high temperatures. At 500 $^\circ$C, our devices show 1 million read cycles and stable On-Off ratio above 1 for > 6 hours. Finally, the operating voltages of our AlScN ferrodiodes are < 15 V at 600 $^\circ$C which is well matched and compatible with Silicon Carbide (SiC) based high temperature logic technology, thereby making our demonstration a major step towards commercialization of NVM integrated high-T computers.
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Submitted 8 September, 2023;
originally announced September 2023.
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Exciton Confinement in Two-Dimensional, In-Plane, Quantum Heterostructures
Authors:
Gwangwoo Kim,
Benjamin Huet,
Christopher E. Stevens,
Kiyoung Jo,
Jeng-Yuan Tsai,
Saiphaneendra Bachu,
Meghan Leger,
Kyung Yeol Ma,
Nicholas R. Glavin,
Hyeon Suk Shin,
Nasim Alem,
Qimin Yan,
Joshua R. Hedrickson,
Joan M. Redwing,
Deep Jariwala
Abstract:
Two-dimensional (2D) semiconductors are promising candidates for optoelectronic application and quantum information processes due to their inherent out-of-plane 2D confinement. In addition, they offer the possibility of achieving low-dimensional in-plane exciton confinement, similar to zero-dimensional quantum dots, with intriguing optical and electronic properties via strain or composition engine…
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Two-dimensional (2D) semiconductors are promising candidates for optoelectronic application and quantum information processes due to their inherent out-of-plane 2D confinement. In addition, they offer the possibility of achieving low-dimensional in-plane exciton confinement, similar to zero-dimensional quantum dots, with intriguing optical and electronic properties via strain or composition engineering. However, realizing such laterally confined 2D monolayers and systematically controlling size-dependent optical properties remain significant challenges. Here, we report the observation of lateral confinement of excitons in epitaxially grown in-plane MoSe2 quantum dots (~15-60 nm wide) inside a continuous matrix of WSe2 monolayer film via a sequential epitaxial growth process. Various optical spectroscopy techniques reveal the size-dependent exciton confinement in the MoSe2 monolayer quantum dots with exciton blue shift (12-40 meV) at a low temperature as compared to continuous monolayer MoSe2. Finally, single-photon emission was also observed from the smallest dots at 1.6 K. Our study opens the door to compositionally engineered, tunable, in-plane quantum light sources in 2D semiconductors.
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Submitted 12 July, 2023;
originally announced July 2023.
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Wafer-scale growth of two-dimensional, phase-pure InSe
Authors:
Seunguk Song,
Sungho Jeon,
Mahfujur Rahaman,
Jason Lynch,
Pawan Kumar,
Srikrishna Chakravarthi,
Gwangwoo Kim,
Xingyu Du,
Eric Blanton,
Kim Kisslinger,
Michael Snure,
Nicholas R. Glavin,
Eric A. Stach,
Roy H. Olsson,
Deep Jariwala
Abstract:
Two-dimensional (2D) indium monoselenide (InSe) has attracted significant attention as a III-VI two-dimensional semiconductor (2D) with a combination of favorable attributes from III-V semiconductors as well as van der Waals 2D transition metal dichalcogenides. Nevertheless, the large-area synthesis of phase-pure 2D InSe remains unattained due to the complexity of the binary In-Se system and the d…
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Two-dimensional (2D) indium monoselenide (InSe) has attracted significant attention as a III-VI two-dimensional semiconductor (2D) with a combination of favorable attributes from III-V semiconductors as well as van der Waals 2D transition metal dichalcogenides. Nevertheless, the large-area synthesis of phase-pure 2D InSe remains unattained due to the complexity of the binary In-Se system and the difficulties in promoting lateral growth. Here, we report the first polymorph-selective synthesis of epitaxial 2D InSe by metal-organic chemical deposition (MOCVD) over 2 inch diameter sapphire wafers. We achieve thickness-controlled, layer-by-layer epitaxial growth of InSe on c-plane sapphire via dynamic pulse control of Se/In flux ratio. The layer-by-layer growth allows thickness control over wafer scale with tunable optical properties comparable to bulk crystals. Finally, the gate-tunable electrical transport suggests that MOCVD-grown InSe could be a potential channel material for back-end-of-line integration in logic transistors with field-effect mobility comparable to single-crystalline flakes.
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Submitted 4 March, 2023;
originally announced March 2023.
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Atomically Thin Yellow Pearl: An Impetus for Thermal Nonlinear Optical Effect Assisted Continuous Wave Random Lasing
Authors:
N. Mandal,
A. Pramanik,
A. Dey,
P. Kumbhakar,
V. Kochat,
A. R. S. Gautam,
N. Glavin,
A. K. Roy,
P. M. Ajayan,
C. S. Tiwary
Abstract:
Above cryogenic temperatures, random laser (RL) emission under continuous wave (CW) optical pum** is often challenging for materials having plenty of lattice defects. Thus, intensive care is required while fabricating the RL device. Synthesis of 2D materials having unique functionality at the atomic limit is necessary for use in such devices. In this work, defects-free 2D yellow pearl (2D-YP) ha…
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Above cryogenic temperatures, random laser (RL) emission under continuous wave (CW) optical pum** is often challenging for materials having plenty of lattice defects. Thus, intensive care is required while fabricating the RL device. Synthesis of 2D materials having unique functionality at the atomic limit is necessary for use in such devices. In this work, defects-free 2D yellow pearl (2D-YP) has been synthesized from bulk south sea pearl using liquid-phase exfoliation (LPE) technique. Thereafter, 2D-YP has been employed as passive scatterer to achieve CW pumped RL emission from a conventional gain molecule, i.e., Rhodamine B (RhB). Compared to other semiconductor (TiO2) and 2D (Graphene and h-BN) passive scatterers, ~25 times improvement in gain volume is observed for the disordered system consisting of RhB and 2D-YP, i.e., 2D-YP@RhB, which is found to be due to the formation of a large refractive index gradient, as induced by the thermal nonlinear optical (NLO) interaction. Hence, incoherent RL (ic-RL) emission ~591 nm is reported for 2D-YP@RhB at a lowest threshold input pump power and a linewidth of 65 mW and 3 nm, respectively. Additionaly, a clear transition from ic-RL to mode tunable coherent RL (c-RL) emission is also possible by altering the configuration of the 2D-YP@RhB container. Therefore, the newly designed Van der Waals heterostructure, i.e., 2D-YP with intrinsic photon trap** capability may pave an avenue towards develo** future exciting optoelectronic devices.
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Submitted 27 September, 2022;
originally announced September 2022.
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Ultrathin Broadband Metasurface Superabsorbers from a van der Waals Semimetal
Authors:
Adam D. Alfieri,
Michael J. Motala,
Michael Snure,
Jason Lynch,
Pawan Kumar,
Huiqin Zhang,
Susanna Post,
Christopher Muratore,
Joshua R. Hendrickson,
Nicholas R. Glavin,
Deep Jariwala
Abstract:
Metamaterials and metasurfaces operating in the visible and near-infrared (NIR) offer a promising route towards next-generation photodetectors and devices for solar energy harvesting. While numerous metamaterials and metasurfaces using metals and semiconductors have been demonstrated, semimetals-based metasurfaces in the vis-NIR range are notably missing. Here, we experimentally demonstrate a broa…
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Metamaterials and metasurfaces operating in the visible and near-infrared (NIR) offer a promising route towards next-generation photodetectors and devices for solar energy harvesting. While numerous metamaterials and metasurfaces using metals and semiconductors have been demonstrated, semimetals-based metasurfaces in the vis-NIR range are notably missing. Here, we experimentally demonstrate a broadband metasurface superabsorber based on large area, semimetallic, van der Waals PtSe2 thin films in agreement with electromagnetic simulations. Our results show that PtSe2 is an ultrathin and scalable semimetal that concurrently possesses high index and high extinction across the vis-NIR range. Consequently, the thin-film PtSe2 on a reflector separated by a dielectric spacer can absorb > 85 % for the unpatterned case and ~97 % for the optimized 2D metasurface in the 400-900 nm range making it one of the strongest and thinnest broadband perfect absorbers to date. Our results present a scalable approach to photodetection and solar energy harvesting, demonstrating the practical utility of high index, high extinction semimetals for nanoscale optics.
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Submitted 28 August, 2022;
originally announced August 2022.
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arXiv:2204.00397
[pdf]
cond-mat.mes-hall
cond-mat.mtrl-sci
cond-mat.other
physics.app-ph
physics.optics
High Density, Localized Quantum Emitters in Strained 2D Semiconductors
Authors:
Gwangwoo Kim,
Hyong Min Kim,
Pawan Kumar,
Mahfujur Rahaman,
Christopher E. Stevens,
Jonghyuk Jeon,
Kiyoung Jo,
Kwan-Ho Kim,
Nicholas Trainor,
Haoyue Zhu,
Byeong-Hyeok Sohn,
Eric A. Stach,
Joshua R. Hendrickson,
Nicholas R Glavin,
Joonki Suh,
Joan M. Redwing,
Deep Jariwala
Abstract:
Two-dimensional chalcogenide semiconductors have recently emerged as a host material for quantum emitters of single photons. While several reports on defect and strain-induced single photon emission from 2D chalcogenides exist, a bottom-up, lithography-free approach to producing a high density of emitters remains elusive. Further, the physical properties of quantum emission in the case of strained…
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Two-dimensional chalcogenide semiconductors have recently emerged as a host material for quantum emitters of single photons. While several reports on defect and strain-induced single photon emission from 2D chalcogenides exist, a bottom-up, lithography-free approach to producing a high density of emitters remains elusive. Further, the physical properties of quantum emission in the case of strained 2D semiconductors are far from being understood. Here, we demonstrate a bottom-up, scalable, and lithography-free approach to creating large areas of localized emitters with high density (~150 emitters/um2) in a WSe2 monolayer. We induce strain inside the WSe2 monolayer with high spatial density by conformally placing the WSe2 monolayer over a uniform array of Pt nanoparticles with a size of 10 nm. Cryogenic, time-resolved, and gate-tunable luminescence measurements combined with near-field luminescence spectroscopy suggest the formation of localized states in strained regions that emit single photons with a high spatial density. Our approach of using a metal nanoparticle array to generate a high density of strained quantum emitters opens a new path towards scalable, tunable, and versatile quantum light sources.
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Submitted 1 April, 2022;
originally announced April 2022.
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High throughput data-driven design of laser crystallized 2D MoS2 chemical sensors
Authors:
Drake Austin,
Paige Miesle,
Deanna Sessions,
Michael Motala,
David Moore,
Griffin Beyer,
Adam Miesle,
Andrew Sarangan,
Amritanand Sebastian,
Saptarshi Das,
Anand Puthirath,
Xiang Zhang,
Jordan Hachtel,
Pulickel Ajayan,
Tyson Back,
Peter Stevenson,
Michael Brothers,
Steven Kim,
Philip Buskohl,
Rahul Rao,
Christopher Muratore,
Nicholas Glavin
Abstract:
High throughput characterization and processing techniques are becoming increasingly necessary to navigate multivariable, data-driven design challenges for sensors and electronic devices. For two-dimensional materials, device performance is highly dependent upon a vast array of material properties including number of layers, lattice strain, carrier concentration, defect density, and grain structur…
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High throughput characterization and processing techniques are becoming increasingly necessary to navigate multivariable, data-driven design challenges for sensors and electronic devices. For two-dimensional materials, device performance is highly dependent upon a vast array of material properties including number of layers, lattice strain, carrier concentration, defect density, and grain structure. In this work, laser-crystallization was used to locally pattern and transform hundreds of regions of amorphous MoS2 thin films into 2D 2H-MoS2. A high throughput Raman spectroscopy approach was subsequently used to assess the process-dependent structural and compositional variations for each illuminated region, yielding over 5500 distinct non-resonant, resonant, and polarized Raman spectra. The rapid generation of a comprehensive library of structural and compositional data elucidated important trends between structure-property-processing relationships involving laser-crystallized MoS2, including the relationships between grain size, grain orientation, and intrinsic strain. Moreover, extensive analysis of structure/property relationships allowed for intelligent design, and evaluation of major contributions to, device performance in MoS2 chemical sensors. In particular, it is found that sensor performance is strongly dependent on the orientation of the MoS2 grains relative to the crystal plane.
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Submitted 26 January, 2022;
originally announced January 2022.
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2D Metal Selenide-Silicon Steep Sub-Threshold Heterojunction Triodes with High On-Current Density
Authors:
**shui Miao,
Chloe Leblanc,
Xiwen Liu,
Baokun Song,
Huairuo Zhang,
Sergiy Krylyuk,
Albert V. Davydov,
Tyson Back,
Nicholas Glavin,
Deep Jariwala
Abstract:
Low power consumption in both static and dynamic modes of operation is a key requirement in modern, highly scaled nanoelectronics. Tunneling field-effect transistors (TFETs) that exploit direct band-to-band tunneling of charges and exhibit steep sub-threshold slope (SS) transfer characteristics are an attractive option in this regard. However, current generation of Si and III-V heterojunction base…
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Low power consumption in both static and dynamic modes of operation is a key requirement in modern, highly scaled nanoelectronics. Tunneling field-effect transistors (TFETs) that exploit direct band-to-band tunneling of charges and exhibit steep sub-threshold slope (SS) transfer characteristics are an attractive option in this regard. However, current generation of Si and III-V heterojunction based TFETs while suffer from low ON current density and ON/OFF current ratios for < 60 mV/dec operation. Semiconducting two-dimensional (2D) layers have recently renewed enthusiasm in novel device design for TFETs not only because of their atomically-thin bodies that favor superior electrostatic control but the same feature also favors higher ON current density and consequently high ON/OFF ratio. Here, we demonstrate gate-tunable heterojunction diodes (triodes) fabricated from InSe/Si 2D/3D van der Waals heterostructures, with a minimum subthreshold swing (SS) as low as 6.4 mV/dec and an SS average of 30 mV/dec over 4 decades of current. Further, the devices show a large current on/off ratio of approximately 10^6 and on-state current density of 0.3 uA/um at a drain bias of -1V. Our work opens new avenues for 2D semiconductors for 3D hetero-integration with Si to achieve ultra-low power logic devices.
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Submitted 11 November, 2021;
originally announced November 2021.
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Scalable synthesis of 2D van der Waals superlattices
Authors:
Michael J. Motala,
Xiang Zhang,
Pawan Kumar,
Eliezer F. Oliveira,
Anna Benton,
Paige Miesle,
Rahul Rao,
Peter R. Stevenson,
David Moore,
Adam Alfieri,
Jason Lynch,
Guanhui Gao,
Sijie Ma,
Hanyu Zhu,
Zhe Wang,
Ivan Petrov,
Eric A. Stach,
W. Joshua Kennedy,
Shiva Vengala,
James M. Tour,
Douglas S. Galvao,
Deep Jariwala,
Christopher Muratore,
Michael Snure,
Pulickel M. Ajayan
, et al. (1 additional authors not shown)
Abstract:
Heterostructure materials form the basis of much of modern electronics, from transistors to lasers and light-emitting diodes. Recent years have seen a renewed focus on creating heterostructures through the vertical integration of two-dimensional materials, including graphene, hexagonal boron nitride, and transition metal dichalcogenides (TMDCs). However, fundamental challenges associated with mate…
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Heterostructure materials form the basis of much of modern electronics, from transistors to lasers and light-emitting diodes. Recent years have seen a renewed focus on creating heterostructures through the vertical integration of two-dimensional materials, including graphene, hexagonal boron nitride, and transition metal dichalcogenides (TMDCs). However, fundamental challenges associated with materials processing have limited material quality and impeded scalability. We demonstrate a method to convert sub-nanometer metal films deposited on silicon and sapphire into TMDC heterostructures through vapor-phase processing. The resulting heterostructures and superlattices exhibit novel properties compared with stand-alone TMDCs, including reduced bandgap, enhanced light-matter coupling, and improved catalytic performance. This robust and scalable synthetic method provides new opportunities to generate a wide range of artificially stacked 2D superlattices with controlled morphology and composition.
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Submitted 4 November, 2021;
originally announced November 2021.
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Synthesis and Tailored Properties Towards Designer Covalent Organic Framework Thin Films and Heterostructures
Authors:
Lucas K. Beagle,
Qiyi Fang,
Ly D. Tran,
Luke A. Baldwin,
Christopher Muratore,
Jun Lou,
Nicholas R. Glavin
Abstract:
Porous polymeric covalent organic frameworks (COFs) have been under intense synthetic investigation with over 100 unique structural motifs known. In order to realize the true potential of these materials, converting the powders into thin films with strict control of thickness and morphology is necessary and accomplished through techniques including interfacial synthesis, chemical exfoliation and m…
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Porous polymeric covalent organic frameworks (COFs) have been under intense synthetic investigation with over 100 unique structural motifs known. In order to realize the true potential of these materials, converting the powders into thin films with strict control of thickness and morphology is necessary and accomplished through techniques including interfacial synthesis, chemical exfoliation and mechanical delamination. Recent progress in the construction and tailored properties of thin film COFs are highlighted in this review, addressing mechanical properties as well as application-focused properties in filtration, electronics, sensors, electrochemical, magnetics, optoelectronics and beyond. Additionally, heterogeneous integration of these thin films with other inorganic and organic materials is discussed, revealing exciting opportunities to integrate COF thin films with other state of the art material and device systems.
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Submitted 26 May, 2021;
originally announced May 2021.
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Spalling-induced liftoff and transfer of electronic films using a van der Waals release layer
Authors:
Eric W. Blanton,
Michael J. Motala,
Timothy A. Prusnick,
Albert Hilton,
Jeff L. Brown,
Arkka Bhattacharyya,
Sriram Krishnamoorthy,
Kevin Leedy,
Nicholas R. Glavin,
Michael Snure
Abstract:
Heterogeneous integration strategies are increasingly being employed to achieve more compact and capable electronics systems for multiple applications including space, electric vehicles, and wearable and medical devices. To enable new integration strategies, the growth and transfer of thin electronic films and devices, including III-nitrides, metal oxides, and two-dimensional (2D) materials, using…
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Heterogeneous integration strategies are increasingly being employed to achieve more compact and capable electronics systems for multiple applications including space, electric vehicles, and wearable and medical devices. To enable new integration strategies, the growth and transfer of thin electronic films and devices, including III-nitrides, metal oxides, and two-dimensional (2D) materials, using 2D boron nitride (BN)-on-sapphire templates is demonstrated. The van der Waals BN layer, in this case, acts as a preferred mechanical release layer for precise separation at the substrate-film interface and leaves a smooth surface suitable for van der Waals bonding. A tensilely-stressed Ni layer sputtered on top of the film induces controlled spalling fracture which propagates at the BN/sapphire interface. By incorporating controlled spalling, the process yield and sensitivity is greatly improved, owed to the greater fracture energy provided by the stressed metal layer relative to a soft tape or rubber stamp. With stress playing a critical role in this process, the influence of residual stress on detrimental cracking and bowing is investigated. Additionally, a selected area lift-off technique is developed which allows for isolation and transfer of individual devices while maximizing wafer area use and minimizing extra alignment steps in the integration process.
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Submitted 14 May, 2021;
originally announced May 2021.
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Light-Matter Coupling in Scalable Van der Waals Superlattices
Authors:
Pawan Kumar,
Jason Lynch,
Baokun Song,
Haonan Ling,
Francisco Barrera,
Huiqin Zhang,
Surendra B. Anantharaman,
Jagrit Digani,
Haoyue Zhu,
Tanushree H. Choudhury,
Clifford McAleese,
Xiaochen Wang,
Ben R. Conran,
Oliver Whear,
Michael J. Motala,
Michael Snure,
Christopher Muratore,
Joan M. Redwing,
Nicholas R. Glavin,
Eric A. Stach,
Artur R. Davoyan,
Deep Jariwala
Abstract:
Two-dimensional (2D) crystals have renewed opportunities in design and assembly of artificial lattices without the constraints of epitaxy. However, the lack of thickness control in exfoliated van der Waals (vdW) layers prevents realization of repeat units with high fidelity. Recent availability of uniform, wafer-scale samples permits engineering of both electronic and optical dispersions in stacks…
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Two-dimensional (2D) crystals have renewed opportunities in design and assembly of artificial lattices without the constraints of epitaxy. However, the lack of thickness control in exfoliated van der Waals (vdW) layers prevents realization of repeat units with high fidelity. Recent availability of uniform, wafer-scale samples permits engineering of both electronic and optical dispersions in stacks of disparate 2D layers with multiple repeating units. We present optical dispersion engineering in a superlattice structure comprised of alternating layers of 2D excitonic chalcogenides and dielectric insulators. By carefully designing the unit cell parameters, we demonstrate > 90 % narrowband absorption in < 4 nm active layer excitonic absorber medium at room temperature, concurrently with enhanced photoluminescence in cm2 samples. These superlattices show evidence of strong light-matter coupling and exciton-polariton formation with geometry-tunable coupling constants. Our results demonstrate proof of concept structures with engineered optical properties and pave the way for a broad class of scalable, designer optical metamaterials from atomically-thin layers.
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Submitted 25 March, 2021;
originally announced March 2021.
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Direct Opto-Electronic Imaging of 2D Semiconductor - 3D Metal Buried Interfaces
Authors:
Kiyoung Jo,
Pawan Kumar,
Joseph Orr,
Surendra B. Anantharaman,
**shui Miao,
Michael Motala,
Arkamita Bandyopadhyay,
Kim Kisslinger,
Christopher Muratore,
Vivek B. Shenoy,
Eric Stach,
Nicholas Glavin,
Deep Jariwala
Abstract:
The semiconductor-metal junction is one of the most critical factors for high performance electronic devices. In two-dimensional (2D) semiconductor devices, minimizing the voltage drop at this junction is particularly challenging and important. Despite numerous studies concerning contact resistance in 2D semiconductors, the exact nature of the buried interface under a three-dimensional (3D) metal…
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The semiconductor-metal junction is one of the most critical factors for high performance electronic devices. In two-dimensional (2D) semiconductor devices, minimizing the voltage drop at this junction is particularly challenging and important. Despite numerous studies concerning contact resistance in 2D semiconductors, the exact nature of the buried interface under a three-dimensional (3D) metal remains unclear. Herein, we report the direct measurement of electrical and optical responses of 2D semiconductor-metal buried interfaces using a recently developed metal-assisted transfer technique to expose the buried interface which is then directly investigated using scanning probe techniques. We characterize the spatially varying electronic and optical properties of this buried interface with < 20 nm resolution. To be specific, potential, conductance and photoluminescence at the buried metal/MoS$_2$ interface are correlated as a function of a variety of metal deposition conditions as well as the type of metal contacts. We observe that direct evaporation of Au on MoS$_2$ induces a large strain of ~5% in the MoS$_2$ which, coupled with charge transfer, leads to degenerate do** of the MoS$_2$ underneath the contact. These factors lead to improvement of contact resistance to record values of 138 kohm-um, as measured using local conductance probes. This approach was adopted to characterize MoS$_2$-In/Au alloy interfaces, demonstrating contact resistance as low as 63 kohm-um. Our results highlight that the MoS$_2$/Metal interface is sensitive to device fabrication methods, and provides a universal strategy to characterize buried contact interfaces involving 2D semiconductors.
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Submitted 28 January, 2021;
originally announced January 2021.
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Transferrable AlGaN/GaN HEMTs to Arbitrary Substrates via a Two-dimensional Boron Nitride Release Layer
Authors:
Michael J. Motala,
Eric Blanton,
Al Hilton,
Eric Heller,
Chris Muratore,
Katherine Burzynski,
Jeff Brown,
Kelson Chabak,
Michael Durstock,
Michael Snure,
Nicholas Glavin
Abstract:
Mechanical transfer of high performing thin film devices onto arbitrary substrates represents an exciting opportunity to improve device performance, explore non-traditional manufacturing approaches, and paves the way for soft, conformal, and flexible electronics. Using a two-dimensional (2D) boron nitride (BN) release layer, we demonstrate the transfer of AlGaN/GaN high-electron mobility transisto…
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Mechanical transfer of high performing thin film devices onto arbitrary substrates represents an exciting opportunity to improve device performance, explore non-traditional manufacturing approaches, and paves the way for soft, conformal, and flexible electronics. Using a two-dimensional (2D) boron nitride (BN) release layer, we demonstrate the transfer of AlGaN/GaN high-electron mobility transistors (HEMTs) to arbitrary substrates through both direct van der Waals (vdW) bonding and with a polymer adhesive interlayer. No device degradation was observed due to the transfer process, and a significant reduction in device temperature (327 °C to 132 °C at 600 mW) was observed when directly bonded to a silicon carbide (SiC) wafer relative to the starting wafer. With the use of a benzocyclobutene (BCB) adhesion interlayer, devices were easily transferred and characterized on Kapton and ceramic films, representing an exciting opportunity for integration onto arbitrary substrates. Upon reduction of this polymer adhesive layer thickness, the AlGaN/GaN HEMTs transferred onto a BCB/SiC substrate resulted in comparable peak temperatures during operation at powers as high as 600 mW to the as-grown wafer, revealing that by optimizing interlayer characteristics such as thickness and thermal conductivity, transferrable devices on polymer layers can still improve performance outputs.
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Submitted 7 February, 2020;
originally announced February 2020.