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Performance of Irradiated RD53A 3D Pixel Sensors
Authors:
S. Terzo,
M. Chmeissani,
G. Giannini,
S. Grinstein,
M. Manna,
G. Pellegrini,
D. Quirion,
D. Vazquez Furelos
Abstract:
The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking detector. 3D sensors with a small pixel size of $\mathrm{50 \times 50~μm^{2}}$ and $\mathrm{25 \times 100~μm^{2}}$ compatible with the first prototype ASIC for th…
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The ATLAS experiment at the LHC will replace its current inner tracker system for the HL-LHC era. 3D silicon pixel sensors are being considered as radiation-hard candidates for the innermost layers of the new fully silicon-based tracking detector. 3D sensors with a small pixel size of $\mathrm{50 \times 50~μm^{2}}$ and $\mathrm{25 \times 100~μm^{2}}$ compatible with the first prototype ASIC for the HL-LHC, the RD53A chip, have been studied in beam tests after uniform irradiation to $\mathrm{5 \times 10^{15}~n_{eq}/cm^{2}}$. An operation voltage of only 50 V is needed to achieve a 97% hit efficiency after this fluence.
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Submitted 22 March, 2019; v1 submitted 12 March, 2019;
originally announced March 2019.
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Radiation hardness of small-pitch 3D pixel sensors up to a fluence of $3\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$
Authors:
J. Lange,
G. Giannini,
S. Grinstein,
M. Manna,
G. Pellegrini,
D. Quirion,
S. Terzo,
D. Vázquez Furelos
Abstract:
Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with pixel sizes of 50$\times$50 and 25$\times$100 $μ$m$^{2}$ connected to the existing ATLAS FE-I4 readout chip have been produced by CNM Barcelona. Irradiations up to particle fluences of $3\times10^{16}$ n…
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Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with pixel sizes of 50$\times$50 and 25$\times$100 $μ$m$^{2}$ connected to the existing ATLAS FE-I4 readout chip have been produced by CNM Barcelona. Irradiations up to particle fluences of $3\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$, beyond the full expected HL-LHC fluences at the end of lifetime, have been carried out at Karlsruhe and CERN. The performance of the 50$\times$50 $μ$m$^{2}$ devices has been measured in the laboratory and beam tests at CERN SPS. A high charge collected and a high hit efficiency of 98% were found up to the highest fluence. The bias voltage to reach the target efficiency of 97% at perpendicular beam incidence was found to be about 100 V at $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$ and 150 V at $2.8\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$, significantly lower than for the previous IBL 3D generation with larger inter-electrode distance and than for planar sensors. The power dissipation at -25$^{\circ}$C and $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$ was found to be 13 mW/cm$^2$. Hence, 3D pixel detectors demonstrated superior radiation hardness and were chosen as the baseline for the inner layer of the ATLAS HL-LHC pixel detector upgrade.
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Submitted 17 September, 2018; v1 submitted 25 May, 2018;
originally announced May 2018.
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Radiation hardness of small-pitch 3D pixel sensors up to HL-LHC fluences
Authors:
J. Lange,
S. Grinstein,
M. Manna,
G. Pellegrini,
D. Quirion,
S. Terzo,
D. Vázquez Furelos
Abstract:
A new generation of 3D silicon pixel detectors with a small pixel size of 50$\times$50 and 25$\times$100 $μ$m$^{2}$ is being developed for the HL-LHC tracker upgrades. The radiation hardness of such detectors was studied in beam tests after irradiation to HL-LHC fluences up to $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$. At this fluence, an operation voltage of only 100 V is needed to achieve 97%…
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A new generation of 3D silicon pixel detectors with a small pixel size of 50$\times$50 and 25$\times$100 $μ$m$^{2}$ is being developed for the HL-LHC tracker upgrades. The radiation hardness of such detectors was studied in beam tests after irradiation to HL-LHC fluences up to $1.4\times10^{16}$ n$_{\mathrm{eq}}$/cm$^2$. At this fluence, an operation voltage of only 100 V is needed to achieve 97% hit efficiency, with a power dissipation of 13 mW/cm$^2$ at -25$^{\circ}$C, considerably lower than for previous 3D sensor generations and planar sensors.
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Submitted 4 July, 2017;
originally announced July 2017.
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3D sensors for the HL-LHC
Authors:
D. Vázquez Furelos,
M. Carulla,
E. Cavallaro,
F. Förster,
S. Grinstein,
J. Lange,
I. López Paz,
M. Manna,
G. Pellegrini,
D. Quirion,
S. Terzo
Abstract:
In order to increase its discovery potential, the Large Hadron Collider (LHC) accelerator will be upgraded in the next decade. The high luminosity LHC (HL-LHC) period demands new sensor technologies to cope with increasing radiation fluences and particle rates. The ATLAS experiment will replace the entire inner tracking detector with a completely new silicon-only system. 3D pixel sensors are promi…
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In order to increase its discovery potential, the Large Hadron Collider (LHC) accelerator will be upgraded in the next decade. The high luminosity LHC (HL-LHC) period demands new sensor technologies to cope with increasing radiation fluences and particle rates. The ATLAS experiment will replace the entire inner tracking detector with a completely new silicon-only system. 3D pixel sensors are promising candidates for the innermost layers of the Pixel detector due to their excellent radiation hardness at low operation voltages and low power dissipation at moderate temperatures. Recent developments of 3D sensors for the HL-LHC are presented.
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Submitted 27 October, 2016;
originally announced October 2016.
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3D silicon pixel detectors for the High-Luminosity LHC
Authors:
J. Lange,
M. Carulla Areste,
E. Cavallaro,
F. Förster,
S. Grinstein,
I. López Paz,
M. Manna,
G. Pellegrini,
D. Quirion,
S. Terzo,
D. Vázquez Furelos
Abstract:
3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellen…
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3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation.
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Submitted 16 November, 2016; v1 submitted 24 October, 2016;
originally announced October 2016.
