Thermal conductivity measurements of sub-surface buried substrates by steady-state thermoreflectance
Authors:
Md Shafkat Bin Hoque,
Yee Rui Koh,
Kiumars Aryana,
Eric Hoglund,
Jeffrey L. Braun,
David H. Olson,
John T. Gaskins,
Habib Ahmad,
Mirza Mohammad Mahbube Elahi,
Jennifer K. Hite,
Zayd C. Leseman,
W. Alan Doolittle,
Patrick E. Hopkins
Abstract:
Measuring the thermal conductivity of sub-surface buried substrates are of significant practical interests. However, this remains challenging with traditional pump-probe spectroscopies due to their limited thermal penetration depths (TPD). Here, we experimentally and numerically investigate the TPD of recently developed optical pump-probe technique steady-state thermoreflectance (SSTR) and explore…
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Measuring the thermal conductivity of sub-surface buried substrates are of significant practical interests. However, this remains challenging with traditional pump-probe spectroscopies due to their limited thermal penetration depths (TPD). Here, we experimentally and numerically investigate the TPD of recently developed optical pump-probe technique steady-state thermoreflectance (SSTR) and explore its capability for measuring the thermal properties of buried substrates. The conventional definition of the TPD does not truly represent the upper limit of how far beneath the surface SSTR can probe. For estimating the uncertainty of SSTR measurements of a buried substrate a priori, sensitivity calculations provide the best means. Thus, detailed sensitivity calculations are provided to guide future measurements. Due to the steady-state nature of SSTR, it can measure the thermal conductivity of buried substrates typically inaccessible by traditional pump-probe techniques, exemplified by measuring three control samples. We also discuss the required criteria for SSTR to isolate the thermal properties of a buried film. Our study establishes SSTR as a suitable technique for thermal characterizations of sub-surface buried substrates in typical device geometries.
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Submitted 25 February, 2021;
originally announced February 2021.
