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Optical readout of a superconducting qubit using a scalable piezo-optomechanical transducer
Authors:
T. C. van Thiel,
M. J. Weaver,
F. Berto,
P. Duivestein,
M. Lemang,
K. L. Schuurman,
M. Žemlička,
F. Hijazi,
A. C. Bernasconi,
E. Lachman,
M. Field,
Y. Mohan,
F. K. de Vries,
C. C. Bultink,
J. van Oven,
J. Y. Mutus,
R. Stockill,
S. Gröblacher
Abstract:
Superconducting quantum processors have made significant progress in size and computing potential. As a result, the practical cryogenic limitations of operating large numbers of superconducting qubits are becoming a bottleneck for further scaling. Due to the low thermal conductivity and the dense optical multiplexing capacity of telecommunications fiber, converting qubit signal processing to the o…
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Superconducting quantum processors have made significant progress in size and computing potential. As a result, the practical cryogenic limitations of operating large numbers of superconducting qubits are becoming a bottleneck for further scaling. Due to the low thermal conductivity and the dense optical multiplexing capacity of telecommunications fiber, converting qubit signal processing to the optical domain using microwave-to-optics transduction would significantly relax the strain on cryogenic space and thermal budgets. Here, we demonstrate high-fidelity multi-shot optical readout through an optical fiber of a superconducting transmon qubit connected via a coaxial cable to a fully integrated piezo-optomechanical transducer. Using a demolition readout technique, we achieve a multi-shot readout fidelity of >0.99 at 6 $μ$W of optical power transmitted into the cryostat with as few as 200 averages, without the use of a quantum-limited amplifier. With improved frequency matching between the transducer and the qubit readout resonator, we anticipate that single-shot optical readout is achievable. Due to the small footprint (<0.15mm$^2$) and the modular fiber-based architecture, this device platform has the potential to scale towards use with thousands of qubits. Our results illustrate the potential of piezo-optomechanical transduction for low-dissipation operation of large quantum processors.
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Submitted 2 November, 2023; v1 submitted 9 October, 2023;
originally announced October 2023.
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Wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan-style Josephson junctions for superconducting quantum processors
Authors:
N. Muthusubramanian,
P. Duivestein,
C. Zachariadis,
M. Finkel,
S. L. M. van der Meer,
H. M. Veen,
M. W. Beekman,
T. Stavenga,
A. Bruno,
L. DiCarlo
Abstract:
We investigate die-level and wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan Josephson junctions, using multiple substrates with and without through-silicon vias (TSVs). Dolan junctions fabricated on planar substrates have the highest yield and lowest room-temperature conductance spread, equivalent to ~100 MHz in transmon frequency. In TSV-integrated substrates, Dolan junctions suf…
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We investigate die-level and wafer-scale uniformity of Dolan-bridge and bridgeless Manhattan Josephson junctions, using multiple substrates with and without through-silicon vias (TSVs). Dolan junctions fabricated on planar substrates have the highest yield and lowest room-temperature conductance spread, equivalent to ~100 MHz in transmon frequency. In TSV-integrated substrates, Dolan junctions suffer most in both yield and disorder, making Manhattan junctions preferable. Manhattan junctions show pronounced conductance decrease from wafer centre to edge, which we qualitatively capture using a geometric model of spatially-dependent resist shadowing during junction electrode evaporation. Analysis of actual junction overlap areas using scanning electron micrographs supports the model, and further points to a remnant spatial dependence possibly due to contact resistance.
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Submitted 18 April, 2023;
originally announced April 2023.
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An integrated microwave-to-optics interface for scalable quantum computing
Authors:
Matthew J. Weaver,
Pim Duivestein,
Alexandra C. Bernasconi,
Selim Scharmer,
Mathilde Lemang,
Thierry C. van Thiel,
Frederick Hijazi,
Bas Hensen,
Simon Gröblacher,
Robert Stockill
Abstract:
Microwave-to-optics transduction is emerging as a vital technology for scaling quantum computers and quantum networks. To establish useful entanglement links between qubit processing units, several key conditions have to be simultaneously met: the transducer must add less than a single quantum of input referred noise and operate with high-efficiency, as well as large bandwidth and high repetition…
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Microwave-to-optics transduction is emerging as a vital technology for scaling quantum computers and quantum networks. To establish useful entanglement links between qubit processing units, several key conditions have to be simultaneously met: the transducer must add less than a single quantum of input referred noise and operate with high-efficiency, as well as large bandwidth and high repetition rate. Here we present a new design for an integrated transducer based on a planar superconducting resonator coupled to a silicon photonic cavity through a mechanical oscillator made of lithium niobate on silicon. We experimentally demonstrate its unique performance and potential for simultaneously realizing all of the above conditions, measuring added noise that is limited to a few photons, transduction efficiencies as high as 0.9%, with a bandwidth of 14.8 MHz and a repetition rate of up to 100 kHz. Our device couples directly to a 50-Ohm transmission line and can easily be scaled to a large number of transducers on a single chip, paving the way for distributed quantum computing.
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Submitted 27 October, 2022;
originally announced October 2022.
