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EDA Corpus: A Large Language Model Dataset for Enhanced Interaction with OpenROAD
Authors:
Bing-Yue Wu,
Utsav Sharma,
Sai Rahul Dhanvi Kankipati,
Ajay Yadav,
Bintu Kappil George,
Sai Ritish Guntupalli,
Austin Rovinski,
Vidya A. Chhabria
Abstract:
Large language models (LLMs) serve as powerful tools for design, providing capabilities for both task automation and design assistance. Recent advancements have shown tremendous potential for facilitating LLM integration into the chip design process; however, many of these works rely on data that are not publicly available and/or not permissively licensed for use in LLM training and distribution.…
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Large language models (LLMs) serve as powerful tools for design, providing capabilities for both task automation and design assistance. Recent advancements have shown tremendous potential for facilitating LLM integration into the chip design process; however, many of these works rely on data that are not publicly available and/or not permissively licensed for use in LLM training and distribution. In this paper, we present a solution aimed at bridging this gap by introducing an open-source dataset tailored for OpenROAD, a widely adopted open-source EDA toolchain. The dataset features over 1000 data points and is structured in two formats: (i) a pairwise set comprised of question prompts with prose answers, and (ii) a pairwise set comprised of code prompts and their corresponding OpenROAD scripts. By providing this dataset, we aim to facilitate LLM-focused research within the EDA domain. The dataset is available at https://github.com/OpenROAD-Assistant/EDA-Corpus.
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Submitted 4 May, 2024;
originally announced May 2024.
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IR-Aware ECO Timing Optimization Using Reinforcement Learning
Authors:
Vidya A. Chhabria,
Wen**g Jiang,
Sachin S. Sapatnekar
Abstract:
Engineering change orders (ECOs) in late stages make minimal design fixes to recover from timing shifts due to excessive IR drops. This paper integrates IR-drop-aware timing analysis and ECO timing optimization using reinforcement learning (RL). The method operates after physical design and power grid synthesis, and rectifies IR-drop-induced timing degradation through gate sizing. It incorporates…
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Engineering change orders (ECOs) in late stages make minimal design fixes to recover from timing shifts due to excessive IR drops. This paper integrates IR-drop-aware timing analysis and ECO timing optimization using reinforcement learning (RL). The method operates after physical design and power grid synthesis, and rectifies IR-drop-induced timing degradation through gate sizing. It incorporates the Lagrangian relaxation (LR) technique into a novel RL framework, which trains a relational graph convolutional network (R-GCN) agent to sequentially size gates to fix timing violations. The R-GCN agent outperforms a classical LR-only algorithm: in an open 45nm technology, it (a) moves the Pareto front of the delay-area tradeoff curve to the left and (b) saves runtime over the classical method by running fast inference using trained models at iso-quality. The RL model is transferable across timing specifications, and transferable to unseen designs with zero-shot learning or fine tuning.
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Submitted 12 February, 2024;
originally announced February 2024.
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GreenFPGA: Evaluating FPGAs as Environmentally Sustainable Computing Solutions
Authors:
Chetan Choppali Sudarshan,
Aman Arora,
Vidya A. Chhabria
Abstract:
Growing global concerns about climate change highlight the need for environmentally sustainable computing. The ecological impact of computing, including operational and embodied, is a key consideration. Field Programmable Gate Arrays (FPGAs) stand out as promising sustainable computing platforms due to their reconfigurability across various applications. This paper introduces GreenFPGA, a tool est…
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Growing global concerns about climate change highlight the need for environmentally sustainable computing. The ecological impact of computing, including operational and embodied, is a key consideration. Field Programmable Gate Arrays (FPGAs) stand out as promising sustainable computing platforms due to their reconfigurability across various applications. This paper introduces GreenFPGA, a tool estimating the total carbon footprint (CFP) of FPGAs over their lifespan, considering design, manufacturing, reconfigurability (reuse), operation, disposal, and recycling. Using GreenFPGA, the paper evaluates scenarios where the ecological benefits of FPGA reconfigurability outweigh operational and embodied carbon costs, positioning FPGAs as a environmentally sustainable choice for hardware acceleration compared to Application-Specific Integrated Circuits (ASICs). Experimental results show that FPGAs have lower CFP than ASICs, particularly for multiple distinct, low-volume applications, or short application lifespans.
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Submitted 21 November, 2023;
originally announced November 2023.
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ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI
Authors:
Chetan Choppali Sudarshan,
Nikhil Matkar,
Sarma Vrudhula,
Sachin S. Sapatnekar,
Vidya A. Chhabria
Abstract:
Decades of progress in energy-efficient and low-power design have successfully reduced the operational carbon footprint in the semiconductor industry. However, this has led to an increase in embodied emissions, encompassing carbon emissions arising from design, manufacturing, packaging, and other infrastructural activities. While existing research has developed tools to analyze embodied carbon at…
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Decades of progress in energy-efficient and low-power design have successfully reduced the operational carbon footprint in the semiconductor industry. However, this has led to an increase in embodied emissions, encompassing carbon emissions arising from design, manufacturing, packaging, and other infrastructural activities. While existing research has developed tools to analyze embodied carbon at the computer architecture level for traditional monolithic systems, these tools do not apply to near-mainstream heterogeneous integration (HI) technologies. HI systems offer significant potential for sustainable computing by minimizing carbon emissions through two key strategies: ``reducing" computation by reusing pre-designed chiplet IP blocks and adopting hierarchical approaches to system design. The reuse of chiplets across multiple designs, even spanning multiple generations of integrated circuits (ICs), can substantially reduce embodied carbon emissions throughout the operational lifespan. This paper introduces a carbon analysis tool specifically designed to assess the potential of HI systems in facilitating greener VLSI system design and manufacturing approaches. The tool takes into account scaling, chiplet and packaging yields, design complexity, and even carbon overheads associated with advanced packaging techniques employed in heterogeneous systems. Experimental results demonstrate that HI can achieve a reduction of embodied carbon emissions up to 70\% compared to traditional large monolithic systems. These findings suggest that HI can pave the way for sustainable computing practices, contributing to a more environmentally conscious semiconductor industry.
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Submitted 14 February, 2024; v1 submitted 15 June, 2023;
originally announced June 2023.
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A Machine Learning Approach to Improving Timing Consistency between Global Route and Detailed Route
Authors:
Vidya A. Chhabria,
Wen**g Jiang,
Andrew B. Kahng,
Sachin S. Sapatnekar
Abstract:
Due to the unavailability of routing information in design stages prior to detailed routing (DR), the tasks of timing prediction and optimization pose major challenges. Inaccurate timing prediction wastes design effort, hurts circuit performance, and may lead to design failure. This work focuses on timing prediction after clock tree synthesis and placement legalization, which is the earliest oppor…
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Due to the unavailability of routing information in design stages prior to detailed routing (DR), the tasks of timing prediction and optimization pose major challenges. Inaccurate timing prediction wastes design effort, hurts circuit performance, and may lead to design failure. This work focuses on timing prediction after clock tree synthesis and placement legalization, which is the earliest opportunity to time and optimize a "complete" netlist. The paper first documents that having "oracle knowledge" of the final post-DR parasitics enables post-global routing (GR) optimization to produce improved final timing outcomes. To bridge the gap between GR-based parasitic and timing estimation and post-DR results during post-GR optimization, machine learning (ML)-based models are proposed, including the use of features for macro blockages for accurate predictions for designs with macros. Based on a set of experimental evaluations, it is demonstrated that these models show higher accuracy than GR-based timing estimation. When used during post-GR optimization, the ML-based models show demonstrable improvements in post-DR circuit performance. The methodology is applied to two different tool flows - OpenROAD and a commercial tool flow - and results on 45nm bulk and 12nm FinFET enablements show improvements in post-DR slack metrics without increasing congestion. The models are demonstrated to be generalizable to designs generated under different clock period constraints and are robust to training data with small levels of noise.
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Submitted 2 October, 2023; v1 submitted 11 May, 2023;
originally announced May 2023.
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A Linear-Time Algorithm for Steady-State Analysis of Electromigration in General Interconnects
Authors:
Mohammad Abdullah Al Shohel,
Vidya A. Chhabria,
Sachin S. Sapatnekar
Abstract:
Electromigration (EM) is a key reliability issue in deeply scaled technology nodes. Traditional EM methods first filter immortal wires using the Blech criterion, and then perform EM analysis based on Black's equation on the remaining wires. The Blech criterion is based on finding the steady-state stress in a two-terminal wire segment, but most on-chip structures are considerably more complex. Curr…
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Electromigration (EM) is a key reliability issue in deeply scaled technology nodes. Traditional EM methods first filter immortal wires using the Blech criterion, and then perform EM analysis based on Black's equation on the remaining wires. The Blech criterion is based on finding the steady-state stress in a two-terminal wire segment, but most on-chip structures are considerably more complex. Current-density-based assessment methodologies, i.e., Black's equation and the Blech criterion, which are predominantly used to detect EM-susceptible wires, do not capture the physics of EM, but alternative physics-based methods involve the solution of differential equations and are slow. This paper uses first principles, based on solving fundamental stress equations that relate electron wind and back-stress forces to the stress evolution in an interconnect, and devises a technique that analyzes any general tree or mesh interconnect structure to test for immortality. The resulting solution is extremely computationally efficient and its computation time is linear in the number of metal segments. Two variants of the method are proposed: a current-density-based method that requires traversals of the interconnect graph, and a voltage-based formulation negates the need for any traversals. The methods are applied to large interconnect networks for determining the steady-state stress at all nodes and test all segments of each network for immortality. The proposed model is applied to a variety of tree and mesh structures and is demonstrated to be fast. By construction, it is an exact solution and it is demonstrated to match much more computationally expensive numerical simulations.
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Submitted 26 December, 2021;
originally announced December 2021.
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Encoder-Decoder Networks for Analyzing Thermal and Power Delivery Networks
Authors:
Vidya A. Chhabria,
Vipul Ahuja,
Ashwath Prabhu,
Nikhil Patil,
Palkesh Jain,
Sachin S. Sapatnekar
Abstract:
Power delivery network (PDN) analysis and thermal analysis are computationally expensive tasks that are essential for successful IC design. Algorithmically, both these analyses have similar computational structure and complexity as they involve the solution to a partial differential equation of the same form. This paper converts these analyses into image-to-image and sequence-to-sequence translati…
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Power delivery network (PDN) analysis and thermal analysis are computationally expensive tasks that are essential for successful IC design. Algorithmically, both these analyses have similar computational structure and complexity as they involve the solution to a partial differential equation of the same form. This paper converts these analyses into image-to-image and sequence-to-sequence translation tasks, which allows leveraging a class of machine learning models with an encoder-decoder-based generative (EDGe) architecture to address the time-intensive nature of these tasks. For PDN analysis, we propose two networks: (i) IREDGe: a full-chip static and dynamic IR drop predictor and (ii) EMEDGe: electromigration (EM) hotspot classifier based on input power, power grid distribution, and power pad distribution patterns. For thermal analysis, we propose ThermEDGe, a full-chip static and dynamic temperature estimator based on input power distribution patterns for thermal analysis. These networks are transferable across designs synthesized within the same technology and packing solution. The networks predict on-chip IR drop, EM hotspot locations, and temperature in milliseconds with negligibly small errors against commercial tools requiring several hours.
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Submitted 27 October, 2021;
originally announced October 2021.
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OpeNPDN: A Neural-network-based Framework for Power Delivery Network Synthesis
Authors:
Vidya A. Chhabria,
Sachin S. Sapatnekar
Abstract:
Power delivery network (PDN) design is a nontrivial, time-intensive, and iterative task. Correct PDN design must account for considerations related to power bumps, currents, blockages, and signal congestion distribution patterns. This work proposes a machine learning-based methodology that employs a set of predefined PDN templates. At the floorplan stage, coarse estimates of current, congestion, m…
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Power delivery network (PDN) design is a nontrivial, time-intensive, and iterative task. Correct PDN design must account for considerations related to power bumps, currents, blockages, and signal congestion distribution patterns. This work proposes a machine learning-based methodology that employs a set of predefined PDN templates. At the floorplan stage, coarse estimates of current, congestion, macro/blockages, and C4 bump distributions are used to synthesize a grid for early design. At the placement stage, the grid is incrementally refined based on more accurate and fine-grained distributions of current and congestion. At each stage, a convolutional neural network (CNN) selects an appropriate PDN template for each region on the chip, building a safe-by-construction PDN that meets IR drop and electromigration (EM) specifications. The CNN is initially trained using a large synthetically-created dataset, following which transfer learning is leveraged to bridge the gap between real-circuit data (with a limited dataset size) and synthetically-generated data. On average, the optimization of the PDN frees thousands of routing tracks in congestion-critical regions, when compared to a globally uniform PDN, while staying within the IR drop and EM limits.
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Submitted 27 October, 2021;
originally announced October 2021.
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A New, Computationally Efficient "Blech Criterion" for Immortality in General Interconnects
Authors:
Mohammad Abdullah Al Shohel,
Vidya A. Chhabria,
Sachin S. Sapatnekar
Abstract:
Traditional methodologies for analyzing electromigration (EM) in VLSI circuits first filter immortal wires using Blech's criterion, and then perform detailed EM analysis on the remaining wires. However, Blech's criterion was designed for two-terminal wires and does not extend to general structures. This paper demonstrates a first-principles-based solution technique for determining the steady-state…
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Traditional methodologies for analyzing electromigration (EM) in VLSI circuits first filter immortal wires using Blech's criterion, and then perform detailed EM analysis on the remaining wires. However, Blech's criterion was designed for two-terminal wires and does not extend to general structures. This paper demonstrates a first-principles-based solution technique for determining the steady-state stress at all the nodes of a general interconnect structure, and develops an immortality test whose complexity is linear in the number of edges of an interconnect structure. The proposed model is applied to a variety of structures. The method is shown to match well with results from numerical solvers, to be scalable to large structures.
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Submitted 18 May, 2021;
originally announced May 2021.
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MAVIREC: ML-Aided Vectored IR-DropEstimation and Classification
Authors:
Vidya A. Chhabria,
Yanqing Zhang,
Haoxing Ren,
Ben Keller,
Brucek Khailany,
Sachin S. Sapatnekar
Abstract:
Vectored IR drop analysis is a critical step in chip signoff that checks the power integrity of an on-chip power delivery network. Due to the prohibitive runtimes of dynamic IR drop analysis, the large number of test patterns must be whittled down to a small subset of worst-case IR vectors. Unlike the traditional slow heuristic method that select a few vectors with incomplete coverage, MAVIREC use…
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Vectored IR drop analysis is a critical step in chip signoff that checks the power integrity of an on-chip power delivery network. Due to the prohibitive runtimes of dynamic IR drop analysis, the large number of test patterns must be whittled down to a small subset of worst-case IR vectors. Unlike the traditional slow heuristic method that select a few vectors with incomplete coverage, MAVIREC uses machine learning techniques -- 3D convolutions and regression-like layers -- for accurately recommending a larger subset of test patterns that exercise worst-case scenarios. In under 30 minutes, MAVIREC profiles 100K-cycle vectors and provides better coverage than a state-of-the-art industrial flow. Further, MAVIREC's IR drop predictor shows 10x speedup with under 4mV RMSE relative to an industrial flow.
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Submitted 18 December, 2020;
originally announced December 2020.
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Thermal and IR Drop Analysis Using Convolutional Encoder-Decoder Networks
Authors:
Vidya A. Chhabria,
Vipul Ahuja,
Ashwath Prabhu,
Nikhil Patil,
Palkesh Jain,
Sachin S. Sapatnekar
Abstract:
Computationally expensive temperature and power grid analyses are required during the design cycle to guide IC design. This paper employs encoder-decoder based generative (EDGe) networks to map these analyses to fast and accurate image-to-image and sequence-to-sequence translation tasks. The network takes a power map as input and outputs the corresponding temperature or IR drop map. We propose two…
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Computationally expensive temperature and power grid analyses are required during the design cycle to guide IC design. This paper employs encoder-decoder based generative (EDGe) networks to map these analyses to fast and accurate image-to-image and sequence-to-sequence translation tasks. The network takes a power map as input and outputs the corresponding temperature or IR drop map. We propose two networks: (i) ThermEDGe: a static and dynamic full-chip temperature estimator and (ii) IREDGe: a full-chip static IR drop predictor based on input power, power grid distribution, and power pad distribution patterns. The models are design-independent and must be trained just once for a particular technology and packaging solution. ThermEDGe and IREDGe are demonstrated to rapidly predict the on-chip temperature and IR drop contours in milliseconds (in contrast with commercial tools that require several hours or more) and provide an average error of 0.6% and 0.008% respectively.
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Submitted 18 September, 2020;
originally announced September 2020.
