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The Dark Energy Camera
Authors:
B. Flaugher,
H. T. Diehl,
K. Honscheid,
T. M. C. Abbott,
O. Alvarez,
R. Angstadt,
J. T. Annis,
M. Antonik,
O. Ballester,
L. Beaufore,
G. M. Bernstein,
R. A. Bernstein,
B. Bigelow,
M. Bonati,
D. Boprie,
D. Brooks,
E. J. Buckley-Geer,
J. Campa,
L. Cardiel-Sas,
F. J. Castander,
J. Castilla,
H. Cease,
J. M. Cela-Ruiz,
S. Chappa,
E. Chi
, et al. (93 additional authors not shown)
Abstract:
The Dark Energy Camera is a new imager with a 2.2-degree diameter field of view mounted at the prime focus of the Victor M. Blanco 4-meter telescope on Cerro Tololo near La Serena, Chile. The camera was designed and constructed by the Dark Energy Survey Collaboration, and meets or exceeds the stringent requirements designed for the wide-field and supernova surveys for which the collaboration uses…
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The Dark Energy Camera is a new imager with a 2.2-degree diameter field of view mounted at the prime focus of the Victor M. Blanco 4-meter telescope on Cerro Tololo near La Serena, Chile. The camera was designed and constructed by the Dark Energy Survey Collaboration, and meets or exceeds the stringent requirements designed for the wide-field and supernova surveys for which the collaboration uses it. The camera consists of a five element optical corrector, seven filters, a shutter with a 60 cm aperture, and a CCD focal plane of 250 micron thick fully-depleted CCDs cooled inside a vacuum Dewar. The 570 Mpixel focal plane comprises 62 2kx4k CCDs for imaging and 12 2kx2k CCDs for guiding and focus. The CCDs have 15 microns x15 microns pixels with a plate scale of 0.263 arc sec per pixel. A hexapod system provides state-of-the-art focus and alignment capability. The camera is read out in 20 seconds with 6-9 electrons readout noise. This paper provides a technical description of the camera's engineering, construction, installation, and current status.
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Submitted 11 April, 2015;
originally announced April 2015.
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Architecture of a Silicon Strip Beam Position Monitor
Authors:
R. Angstadt,
W. Cooper,
M. Demarteau,
J. Green,
S. Jakubowski,
A. Prosser,
R. Rivera,
M. Turqueti,
M. Utes,
Xiao Cai
Abstract:
A collaboration between Fermilab and the Institute for High Energy Physics (IHEP), Bei**g, has developed a beam position monitor for the IHEP test beam facility. This telescope is based on 5 stations of silicon strip detectors having a pitch of 60 microns. The total active area of each layer of the detector is about 12x10 cm2. Readout of the strips is provided through the use of VA1` ASICs mounte…
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A collaboration between Fermilab and the Institute for High Energy Physics (IHEP), Bei**g, has developed a beam position monitor for the IHEP test beam facility. This telescope is based on 5 stations of silicon strip detectors having a pitch of 60 microns. The total active area of each layer of the detector is about 12x10 cm2. Readout of the strips is provided through the use of VA1` ASICs mounted on custom hybrid printed circuit boards and interfaced to Adapter Cards via copper-over-kapton flexible circuits. The Adapter Cards amplify and level-shift the signal for input to the Fermilab CAPTAN data acquisition nodes for data readout and channel configuration. These nodes deliver readout and temperature data from triggered events to an analysis computer over gigabit Ethernet links.
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Submitted 28 October, 2010;
originally announced October 2010.
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The D0 Silicon Microstrip Tracker
Authors:
S. N. Ahmed,
R. Angstadt,
M. Aoki,
B. Åsman,
S. Austin,
L. Bagby,
E. Barberis,
P. Baringer,
A. Bean,
A. Bischoff,
F. Blekman,
T. A. Bolton,
C. Boswell,
M. Bowden,
F. Browning,
D. Buchholz,
S. Burdin,
D. Butler,
H. Cease,
S. Choi,
A. R. Clark,
J. Clutter,
A. Cooper,
W. E. Cooper,
M. Corcoran
, et al. (109 additional authors not shown)
Abstract:
This paper describes the mechanical design, the readout chain, the production, testing and the installation of the Silicon Microstrip Tracker of the D0 experiment at the Fermilab Tevatron collider. In addition, description of the performance of the detector during the experiment data collection between 2001 and 2010 is provided.
This paper describes the mechanical design, the readout chain, the production, testing and the installation of the Silicon Microstrip Tracker of the D0 experiment at the Fermilab Tevatron collider. In addition, description of the performance of the detector during the experiment data collection between 2001 and 2010 is provided.
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Submitted 5 May, 2010;
originally announced May 2010.
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The Layer 0 Inner Silicon Detector of the D0 Experiment
Authors:
R. Angstadt,
L. Bagby,
A. Bean,
T. Bolton,
D. Buchholz,
D. Butler,
L. Christofek,
W. E. Cooper,
C. H. Daly,
M. Demarteau,
J. Foglesong,
C. E. Gerber,
H. Gonzalez,
J. Green,
H. Guldenman,
K. Hanagaki,
K. Herner,
J. Howell,
M. Hrycyk,
M. Johnson,
M. Kirby,
K. Krempetz,
W. Kuykendall,
F. Lehner,
R. Lipton
, et al. (24 additional authors not shown)
Abstract:
This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider. L0 provides tracking information from two layers of sensors, which are mounted with center lines at a radial distance of 16.1 mm and 17.6 mm respect…
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This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider. L0 provides tracking information from two layers of sensors, which are mounted with center lines at a radial distance of 16.1 mm and 17.6 mm respectively from the beam axis. The sensors and readout electronics are mounted on a specially designed and fabricated carbon fiber structure that includes cooling for sensor and readout electronics. The structure has a thin polyimide circuit bonded to it so that the circuit couples electrically to the carbon fiber allowing the support structure to be used both for detector grounding and a low impedance connection between the remotely mounted hybrids and the sensors.
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Submitted 12 November, 2009;
originally announced November 2009.
