Showing 1–4 of 4 results for author: Aghda, S K

Valence electron concentration- and N vacancy-induced elasticity in cubic early transition metal nitrides

Authors: Soheil Karimi Aghda, Dimitri Bogdanovski, Lukas Loefler, Heng Han Sua, Lena Patterer, Damian M. Holzapfel, Arnaud le Febvrier, Marcus Hans, Daniel Primetzhofer, Jochen M. Schneider

Abstract: Motivated by frequently reported deviations from stoichiometry in cubic transition metal nitride (TMNx) thin films, the effect of N-vacancy concentration on the elastic properties of cubic TiNx, ZrNx, VNx, NbNx, and MoNx (0.72<x<1.00) is systematically studied by density functional theory (DFT) calculations. The predictions are validated experimentally for VNx (0.77<x<0.97). The DFT results indica… ▽ More Motivated by frequently reported deviations from stoichiometry in cubic transition metal nitride (TMNx) thin films, the effect of N-vacancy concentration on the elastic properties of cubic TiNx, ZrNx, VNx, NbNx, and MoNx (0.72<x<1.00) is systematically studied by density functional theory (DFT) calculations. The predictions are validated experimentally for VNx (0.77<x<0.97). The DFT results indicate that the elastic behavior of the TMNx depends on both the N-vacancy concentration and the valence electron concentration (VEC) of the transition metal: While TiNx and ZrNx exhibit vacancy-induced reductions in elastic modulus, VNx and NbNx show an increase. These trends can be rationalized by considering vacancy-induced changes in elastic anisotropy and bonding. While introduction of N-vacancies in TiNx results in a significant reduction of elastic modulus along all directions and a lower average bond strength of Ti-N, the vacancy-induced reduction in [001] direction of VNx is overcompensated by the higher stiffness along [011] and [111] directions, resulting in a higher average bond strength of V-N. To validate the predicted vacancy-induced changes in elasticity experimentally, close-to-single-crystal VNx (0.77<x<0.97) are grown on MgO(001) substrates. As the N-content is reduced, the relaxed lattice parameter a0, as probed by X-ray diffraction, decreases from 4.128 A to 4.096 A. This reduction in lattice parameter is accompanied by an anomalous 11% increase in elastic modulus, as determined by nanoindentation. As the experimental data agree with the predictions, the elasticity enhancement in VNx upon N-vacancy formation can be understood based on the concomitant changes in elastic anisotropy and bonding. △ Less

Submitted 27 May, 2023; originally announced May 2023.

Comments: 30 pages, 8 figures in the manuscript, 1 figure in supplementary materials

Large-area deposition of protective (Ti,Al)N coatings onto polycarbonate

Authors: Lena Patterer, Sabrina Kollmann, Teresa de los Arcos, Leonie Jende, Soheil Karimi Aghda, Damian M. Holzapfel, Sameer Aman Salman, Stanislav Mráz, Guido Grundmeier, Jochen M. Schneider

Abstract: Polycarbonate (PC) and protective (Ti,Al)N coatings exhibit extremely different material properties, specifically crystal structure, thermal stability, elastic and plastic behavior as well as thermal expansion coefficients. These differences present formidable challenges for the deposition process development as low-temperature synthesis routes have to be explored to avoid a thermal overload of th… ▽ More Polycarbonate (PC) and protective (Ti,Al)N coatings exhibit extremely different material properties, specifically crystal structure, thermal stability, elastic and plastic behavior as well as thermal expansion coefficients. These differences present formidable challenges for the deposition process development as low-temperature synthesis routes have to be explored to avoid a thermal overload of the polymer substrate. Here, a large-area sputtering process is developed to address the challenges by systematically adjusting target peak power density and duty cycle. Adhering (Ti,Al)N coatings with a critical residual tensile stress of 2.2 +/- 0.2 GPa are obtained in the pulsed direct current magnetron sputtering range, whereas depositions at higher target peak power densities, realized by high power pulsed magnetron sputtering, lead to stress-induced adhesive and/or cohesive failure. The stress-optimized (Ti,Al)N coatings deposited onto PC with a target peak power density of 0.036 kW cm-2 and a duty cycle of 5.3% were investigated by cross-cut test confirming adhesion. By investigating the bond formation at the PC | (Ti,Al)N interface, mostly interfacial CNx bonds and a small fraction of (C-O)-(Ti,Al) bonds are identified by X-ray photoelectron spectroscopy, indicating reactions at the hydrocarbon and the carbonate groups during deposition. Nanoindentation reveals an elastic modulus of 296 +/- 18 GPa for the (Ti,Al)N coating, while a Ti-Al-O layer is formed during electrochemical impedance spectroscopy in a borate buffer solution, indicating protective passivation. This work demonstrates that the challenge posed by the extremely different material properties at the interface of soft polymer substrates and hard coatings can be addressed by systematical variation of the pulsing parameters to reduce the residual film stress. △ Less

Submitted 27 May, 2023; originally announced May 2023.

Bond formation at polycarbonate | X interfaces (X = Al$_2$O$_3$, TiO$_2$, TiAlO$_2$) studied by theory and experiments

Authors: Lena Patterer, Pavel Ondračka, Dimitri Bogdanovski, Stanislav Mráz, Peter J. Pöllmann, Soheil Karimi Aghda, Petr Vašina, Jochen M. Schneider

Abstract: Interfacial bond formation during sputter deposition of metal oxide thin films onto polycarbonate (PC) is investigated by ab initio molecular dynamics simulations and X-ray photoelectron spectroscopy (XPS) analysis of PC | X interfaces (X = Al$_2$O$_3$, TiO$_2$, TiAlO$_2$). Generally, the predicted bond formation is consistent with the experimental data. For all three interfaces, the majority of b… ▽ More Interfacial bond formation during sputter deposition of metal oxide thin films onto polycarbonate (PC) is investigated by ab initio molecular dynamics simulations and X-ray photoelectron spectroscopy (XPS) analysis of PC | X interfaces (X = Al$_2$O$_3$, TiO$_2$, TiAlO$_2$). Generally, the predicted bond formation is consistent with the experimental data. For all three interfaces, the majority of bonds identified by XPS are (C-O)-metal bonds, whereas C-metal bonds are the minority. Compared to the PC | Al$_2$O$_3$ interface, the PC | TiO$_2$ and PC | TiAlO$_2$ interfaces exhibit a reduction in the measured interfacial bond density by ~ 75 and ~ 65%, respectively. Multiplying the predicted bond strength with the corresponding experimentally determined interfacial bond density shows that Al$_2$O$_3$ exhibits the strongest interface with PC, while TiO$_2$ and TiAlO$_2$ exhibit ~ 70 and ~ 60% weaker interfaces, respectively. This can be understood by considering the complex interplay between the metal oxide composition, the bond strength as well as the population of bonds that are formed across the interface. △ Less

Submitted 27 May, 2023; originally announced May 2023.

Correlative Theoretical and Experimental Study of the Polycarbonate | X Interfacial Bond Formation (X = AlN, TiN, TiAlN) during Magnetron Sputtering

Authors: Lena Patterer, Pavel Ondračka, Dimitri Bogdanovski, Stanislav Mráz, Soheil Karimi Aghda, Peter J. Pöllmann, Yu-** Chien, Jochen M. Schneider

Abstract: To understand the interfacial bond formation between polycarbonate (PC) and magnetron-sputtered metal nitride thin films, PC | X interfaces (X = AlN, TiN, TiAlN) are comparatively investigated by ab initio simulations as well as X-ray photoelectron spectroscopy. The simulations predict significant differences at the interface, as N and Ti form bonds with all functional groups of the polymer, while… ▽ More To understand the interfacial bond formation between polycarbonate (PC) and magnetron-sputtered metal nitride thin films, PC | X interfaces (X = AlN, TiN, TiAlN) are comparatively investigated by ab initio simulations as well as X-ray photoelectron spectroscopy. The simulations predict significant differences at the interface, as N and Ti form bonds with all functional groups of the polymer, while Al reacts selectively only with the carbonate group of pristine PC. In good agreement with simulations, experimental data reveal that the PC | AlN and the PC | TiAlN interfaces are mainly defined by interfacial C-N bonds, whereas for PC | TiN, the interface formation is also characterized by numerous C-Ti and (C-O)-Ti bonds. Bond strength calculations combined with the measured interfacial bond density indicate the strongest interface for PC | TiAlN followed by PC | AlN, whereas the weakest is predicted for PC | TiN due to its lower density of strong interfacial C-N bonds. This study shows that the employed computational strategy enables prediction of the interfacial bond formation between PC and metal nitrides and that it is reasonable to assume that the research strategy proposed herein can be readily adapted to other organic | inorganic interfaces. △ Less

Submitted 26 May, 2023; originally announced May 2023.