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Temperature-Dependent Diffuse Reflectance Measurements of Ceramic Powders in the Near- and Mid-Infrared Spectra
Authors:
J. Michael Mayer,
James A. Abraham,
Bryan Kinzer,
Rohini Bala Chandran
Abstract:
This study focuses on experimentally measuring temperature-dependent diffuse reflectance in the near- and mid-infrared spectra for ceramic particles with applications as heat-transfer and thermal-storage media in concentrated solar power (CSP) plants. Specifically, a commercially available sintered bauxite ceramic powder, ACCUCAST ID80, and its primary chemical constituents, alumina (Al2O3) and si…
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This study focuses on experimentally measuring temperature-dependent diffuse reflectance in the near- and mid-infrared spectra for ceramic particles with applications as heat-transfer and thermal-storage media in concentrated solar power (CSP) plants. Specifically, a commercially available sintered bauxite ceramic powder, ACCUCAST ID80, and its primary chemical constituents, alumina (Al2O3) and silica (SiO2), are measured using a Fourier transform infrared spectrometer (FTIR) coupled with a specialized diffuse reflectance accessory and a heated stage. Room-temperature diffuse reflectance measurements show increased absorption in tests with greater mass fractions of the ceramic samples. There is a strong correlation in the measured reflectance spectra of ACCUCAST with alumina and silica in the spectral range 2000-500 cm-1. For the first time, temperature-dependent diffuse reflectance measurements are reported for ACCUCAST, including a novel technique for accessing reflectance values above the limiting temperature of the background material KBr. All three materials exhibit a calculated emittance of ~0.9 at room temperature. However, this value drops to 0.68 at 1000 C for ACCUCAST and ~0.43 for alumina and silica. Thermal cycling in air from 25 C to 1000 C resulted in a visible color change from dark grey to light orange for ACCUCAST and a subsequent 5X greater increase in reflectance at 4000 cm-1 as compared to ACCUCAST thermally cycled at 1000 C in vacuum. Alumina and silica spectra proved to be largely unaffected by thermal cycling under atmospheric and evacuated conditions.
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Submitted 13 April, 2022;
originally announced April 2022.
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Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience)
Authors:
Eric Cheng,
Shahrzad Mirkhani,
Lukasz G. Szafaryn,
Chen-Yong Cher,
Hyungmin Cho,
Kevin Skadron,
Mircea R. Stan,
Klas Lilja,
Jacob A. Abraham,
Pradip Bose,
Subhasish Mitra
Abstract:
We present CLEAR (Cross-Layer Exploration for Architecting Resilience), a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, arc…
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We present CLEAR (Cross-Layer Exploration for Architecting Resilience), a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as cross-layer resilience. In this paper, we focus on radiation-induced soft errors in processor cores. We address both single-event upsets (SEUs) and single-event multiple upsets (SEMUs) in terrestrial environments. Our framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack (586 cross-layer combinations in this paper), derives cost-effective solutions that achieve resilience targets at minimal costs, and provides guidelines for the design of new resilience techniques. Our results demonstrate that a carefully optimized combination of circuit-level hardening, logic-level parity checking, and micro-architectural recovery provides a highly cost-effective soft error resilience solution for general-purpose processor cores. For example, a 50x improvement in silent data corruption rate is achieved at only 2.1% energy cost for an out-of-order core (6.1% for an in-order core) with no speed impact. However, (application-aware) selective circuit-level hardening alone, guided by a thorough analysis of the effects of soft errors on application benchmarks, provides a cost-effective soft error resilience solution as well (with ~1% additional energy cost for a 50x improvement in silent data corruption rate).
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Submitted 28 September, 2017;
originally announced September 2017.
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CLEAR: Cross-Layer Exploration for Architecting Resilience - Combining Hardware and Software Techniques to Tolerate Soft Errors in Processor Cores
Authors:
Eric Cheng,
Shahrzad Mirkhani,
Lukasz G. Szafaryn,
Chen-Yong Cher,
Hyungmin Cho,
Kevin Skadron,
Mircea R. Stan,
Klas Lilja,
Jacob A. Abraham,
Pradip Bose,
Subhasish Mitra
Abstract:
We present a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as…
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We present a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as cross-layer resilience. In this paper, we focus on radiation-induced soft errors in processor cores. We address both single-event upsets (SEUs) and single-event multiple upsets (SEMUs) in terrestrial environments. Our framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack (586 cross-layer combinations in this paper), derives cost-effective solutions that achieve resilience targets at minimal costs, and provides guidelines for the design of new resilience techniques. We demonstrate the practicality and effectiveness of our framework using two diverse designs: a simple, in-order processor core and a complex, out-of-order processor core. Our results demonstrate that a carefully optimized combination of circuit-level hardening, logic-level parity checking, and micro-architectural recovery provides a highly cost-effective soft error resilience solution for general-purpose processor cores. For example, a 50x improvement in silent data corruption rate is achieved at only 2.1% energy cost for an out-of-order core (6.1% for an in-order core) with no speed impact. However, selective circuit-level hardening alone, guided by a thorough analysis of the effects of soft errors on application benchmarks, provides a cost-effective soft error resilience solution as well (with ~1% additional energy cost for a 50x improvement in silent data corruption rate).
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Submitted 23 June, 2016; v1 submitted 11 April, 2016;
originally announced April 2016.
